Patents by Inventor Chaby Hsu

Chaby Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6967844
    Abstract: A ceramic heat sink having a micro-pores structure includes a thermal conductive layer mounted on a surface of a heat source to absorb heat from the heat source, a heat dissipation layer combined with the thermal conductive layer and having a micro-pores structure with hollow crystals to provide a relatively greater surface area, and a cooling fan mounted on the heat dissipation layer to provide a forced convection effect. Thus, the micro-pores structure can increase the contact surface area between the heat sink and the air, thereby enhancing the heat dissipation effect of the ceramic heat sink.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: November 22, 2005
    Assignee: ABC Taiwan Electronics Corp.
    Inventor: Chaby Hsu
  • Publication number: 20050047089
    Abstract: A ceramic heat sink having a micro-pores structure includes a thermal conductive layer mounted on a surface of a heat source to absorb heat from the heat source, a heat dissipation layer combined with the thermal conductive layer and having a micro-pores structure with hollow crystals to provide a relatively greater surface area, and a cooling fan mounted on the heat dissipation layer to provide a forced convection effect. Thus, the micro-pores structure can increase the contact surface area between the heat sink and the air, thereby enhancing the heat dissipation effect of the ceramic heat sink.
    Type: Application
    Filed: August 29, 2003
    Publication date: March 3, 2005
    Inventor: Chaby Hsu
  • Publication number: 20040164269
    Abstract: A low temperature co-fired ferrite-ceramic (FECERA) composite consisting of two different dielectric materials (Ceramic and Ferrite) can be used to make a diversification combination filter component by the process of a multi-layer passive component, so that the combination filter component can prevent the function of electromagnetic interference (EMI) and has an excellent electromagnetic couple effect.
    Type: Application
    Filed: February 25, 2003
    Publication date: August 26, 2004
    Inventor: Chaby Hsu
  • Patent number: 6705393
    Abstract: A ceramic heat sink having a micro-pores structure includes a heat dissipation layer, and a thermal conductive layer. The heat dissipation layer forms a ceramic micro-cell structure, which is combined with a sub-micrometer powder, thereby forming the heat dissipation layer. The thermal conductive layer is mounted on the heat dissipation layer to contact with a heat source. Thus, the thermal conductive layer absorbs the heat energy from the heat source; the heat dissipation layer has a micro-pores structure with hollow crystals, and the air functions as the media of heat dissipation, so that the heat dissipation capacity of the ceramic heat sink is greatly enhanced.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: March 16, 2004
    Assignee: ABC Taiwan Electronics Corp.
    Inventor: Chaby Hsu