Patents by Inventor Chad A. Kumaus

Chad A. Kumaus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
    Patent number: 7727815
    Abstract: A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change temperature that is about the normal operating temperature range of the IC, to bind absorbed and dissolved oxygen in the two phase solder interface material at or near the air to solder surface. Over time this chemical binding action results in an oxide layer at the air to solder surface that slows the rate of oxygen absorption into the solder interface material, and thus reduces the harmful oxidation of the solder to IC package interface and the solder to heat sink interface.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: June 1, 2010
    Assignee: Intel Corporation
    Inventors: Chad A. Kumaus, Carl Deppisch, Daewoong Suh, Ashay A. Dani
  • Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
    Publication number: 20060065974
    Abstract: A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change temperature that is about the normal operating temperature range of the IC, to bind absorbed and dissolved oxygen in the two phase solder interface material at or near the air to solder surface. Over time this chemical binding action results in an oxide layer at the air to solder surface that slows the rate of oxygen absorption into the solder interface material, and thus reduces the harmful oxidation of the solder to IC package interface and the solder to heat sink interface.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 30, 2006
    Inventors: Chad Kumaus, Carl Deppisch, Daewoong Suh, Ashay Dani