Patents by Inventor Chad Bower

Chad Bower has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7360309
    Abstract: A heat exchanger device includes an extruded body that includes one or more layers of channels for coolant flow therethrough, the channels generally having inner diameters of between about 50 microns to about 2000 microns. The device is formed of a material having a high thermal conductivity to facilitate transfer of heat from the heating components present in the subject cooling application to the coolant passing through the heat exchanger and to be compatible with materials of the heating components. The device material is selected from the group consisting of ceramic oxides, ceramic carbides, ceramic nitrides, ceramic borides, ceramic silicides, metals, and intermetallics, and combinations thereof. The heat exchanger device is formed from an extruded filament that is arranged to give the desired channel configuration. The filament includes a central, removable material and an outer material that forms the channel walls upon removal of the central material.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: April 22, 2008
    Assignee: Advanced Ceramics Research, Inc.
    Inventors: K. Ranji Vaidyanathan, Alfonso Ortega, Marlene Platero, Prathib Skandakumaran, Chad Bower
  • Publication number: 20050039885
    Abstract: A heat exchanger device includes an extruded body that includes one or more layers of channels for coolant flow therethrough, the channels generally having inner diameters of between about 50 microns to about 2000 microns. The device is formed of a material having a high thermal conductivity to facilitate transfer of heat from the heating components present in the subject cooling application to the coolant passing through the heat exchanger and to be compatible with materials of the heating components. The device material is selected from the group consisting of ceramic oxides, ceramic carbides, ceramic nitrides, ceramic borides, ceramic suicides, metals, and intermetallics, and combinations thereof. The heat exchanger device is formed from an extruded filament that is arranged to give the desired channel configuration. The filament includes a central, removable material and an outer material that forms the channel walls upon removal of the central material.
    Type: Application
    Filed: January 28, 2004
    Publication date: February 24, 2005
    Applicant: Advanced Ceramics Research, Inc.
    Inventors: K. Vaidyanathan, Alfonso Ortega, Marlene Platero, Prathib Skandakumaran, Chad Bower