Patents by Inventor Chad Brick

Chad Brick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10626198
    Abstract: Embodiments in accordance with the present invention encompass compositions encompassing a procatalyst and a thermal or photoactivator along with one or more monomers which undergo vinyl addition polymerization when said composition is heated to a temperature from 50° C. to 100° C. to form a substantially transparent film. The monomers employed therein have a range of refractive index from 1.4 to 1.6 and thus these compositions can be tailored to form transparent films of varied refractive indices. Accordingly, compositions of this invention are useful in various opto-electronic applications, including as coatings, encapsulants, fillers, leveling agents, among others.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: April 21, 2020
    Assignee: PROMERUS, LLC
    Inventors: Larry F Rhodes, Chad Brick, Doug Skilskyj
  • Publication number: 20180194880
    Abstract: Embodiments in accordance with the present invention encompass compositions encompassing a procatalyst and a thermal or photoactivator along with one or more monomers which undergo vinyl addition polymerization when said composition is heated to a temperature from 50° C. to 100° C. to form a substantially transparent film. The monomers employed therein have a range of refractive index from 1.4 to 1.6 and thus these compositions can be tailored to form transparent films of varied refractive indices. Accordingly, compositions of this invention are useful in various opto-electronic applications, including as coatings, encapsulants, fillers, leveling agents, among others.
    Type: Application
    Filed: January 4, 2018
    Publication date: July 12, 2018
    Applicant: PROMERUS, LLC
    Inventors: LARRY F. RHODES, CHAD BRICK, DOUG SKILSKYJ
  • Publication number: 20150274929
    Abstract: A silicone rubber-based curable composition includes vinyl siloxane, hydrogen siloxane and silica particles, where the content of the silica particles is 26.0 wt % or more and less than 40.0 wt %, and when cured, it can form a silicone rubber exhibiting a physical property of a JIS K6253 (2006) type A durometer hardness of 40.0 mN or more. Further a method for manufacturing a silicone rubber-based curable composition includes a step of obtaining a kneaded product by kneading vinyl siloxane, hydrogen siloxane, silica particles, a silane coupling agent and a catalyst, where the content of the silica particles in the kneaded product is in the range of 40 to 84 parts by weight relative to 100 parts by weight as the total amount of the vinyl siloxane and the hydrogen siloxane.
    Type: Application
    Filed: July 25, 2013
    Publication date: October 1, 2015
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Chad Brick, Motoko Mori
  • Patent number: 8753790
    Abstract: Embodiments in accordance with the present invention encompass self-imageable film forming compositions that comprise norbornene-type polymers and that can be formulated to be either positive tone imaging or negative tone. The films formed thereby are useful in the forming of microelectronic and optoelectronics devices.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: June 17, 2014
    Assignee: Promerus, LLC
    Inventors: Osamu Onishi, Haruo Ikeda, Larry Rhodes, Paul Evans, Edmund Elce, Andrew Bell, Chad Brick, Hendra Ng, Pramod Kandanarachchi
  • Publication number: 20110104614
    Abstract: Embodiments in accordance with the present invention encompass self-imageable film forming compositions that comprise norbornene-type polymers and that can be formulated to be either positive tone imaging or negative tone. The films formed thereby are useful in the forming of microelectronic and optoelectronics devices.
    Type: Application
    Filed: June 30, 2010
    Publication date: May 5, 2011
    Inventors: Osamu Onishi, Haruo Ikeda, Larry Rhodes, Paul Evans, Edmund Elce, Andrew Bell, Chad Brick, Hendra Ng, Pramod Kandanarachchi
  • Publication number: 20060103029
    Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.
    Type: Application
    Filed: October 4, 2005
    Publication date: May 18, 2006
    Inventors: Rafil Basheer, Richard Laine, Santy Sulaiman, Chad Brick, Christopher DeSana
  • Publication number: 20060083925
    Abstract: Functionalized silsesquioxanes containing from 6 to 24 silicon atoms and minimally about 67 mol percent RSiO3/2 moieties where R is a phenyl group bearing a chemically reactive functional group are highly suitable for use as nanoparticles in producing highly ordered nanocomposites of many types, containing a high proportion of interphase. The nanocomposites have unusual physicochemical properties due to the use of uniform, highly functionalized nanoparticles.
    Type: Application
    Filed: March 2, 2005
    Publication date: April 20, 2006
    Inventors: Richard Laine, Ryo Tamaki, Jiwon Choi, Mark Roll, Chad Brick, Michael Asuncion