Patents by Inventor Chad C Schmidt

Chad C Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coupling heat sink to integrated circuit chip with thermal interface material
    Patent number: 8564955
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: October 22, 2013
    Assignee: Apple Inc.
    Inventors: Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L Heirich, Michael D Hillman, Phillip L Mort, Jay S Nigen, Gregory L Tice
  • METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL
    Publication number: 20110228482
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Application
    Filed: June 1, 2011
    Publication date: September 22, 2011
    Applicant: APPLE INC.
    Inventors: Chad C. Schmidt, Richard Lidio Blanco, JR., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen, Gregory L. Tice
  • Method and apparatus for distributing a thermal interface material
    Patent number: 7961469
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: June 14, 2011
    Assignee: Apple Inc.
    Inventors: Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L Heirich, Michael D Hillman, Phillip L Mort, Jay S Nigen, Gregory L Tice
  • METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL
    Publication number: 20100246133
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Applicant: APPLE INC.
    Inventors: Chad C. Schmidt, Richard Lidio Blanco, JR., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen, Gregory L. Tice