Patents by Inventor Chad Cobbley

Chad Cobbley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8599637
    Abstract: Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal. Alternatively, the connector may be configured to generate a signal that causes a host to terminate programming or erase operations prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: December 3, 2013
    Assignee: Micron Technology, Inc.
    Inventors: James Cooke, Peter Feeley, Victor Tsai, William H. Radke, Neal Galbo, Chad Cobbley
  • Publication number: 20120243362
    Abstract: Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal. Alternatively, the connector may be configured to generate a signal that causes a host to terminate programming or erase operations prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
    Type: Application
    Filed: May 29, 2012
    Publication date: September 27, 2012
    Inventors: James Cooke, Peter Feeley, Victor Tsai, William H. Radke, Neal Galbo, Chad Cobbley
  • Patent number: 8189420
    Abstract: Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be specially configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal through which the memory device receives power. Alternatively, the connector may be specially configured to generate a signal that causes a host to terminate programming or erase operations in the memory device prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: May 29, 2012
    Assignee: Micron Technology, Inc.
    Inventors: James Cooke, Peter Feeley, Victor Tsai, William H. Radke, Neal Galbo, Chad Cobbley
  • Publication number: 20100312965
    Abstract: Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be specially configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal through which the memory device receives power. Alternatively, the connector may be specially configured to generate a signal that causes a host to terminate programming or erase operations in the memory device prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
    Type: Application
    Filed: June 4, 2009
    Publication date: December 9, 2010
    Inventors: James Cooke, Peter Feeley, Victor Tsai, William H. Radke, Neal Galbo, Chad Cobbley
  • Publication number: 20080093019
    Abstract: An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.
    Type: Application
    Filed: December 19, 2007
    Publication date: April 24, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Chad Cobbley, Steve Heppler
  • Publication number: 20070145556
    Abstract: Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dices coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
    Type: Application
    Filed: February 20, 2007
    Publication date: June 28, 2007
    Inventors: Todd Bolken, Chad Cobbley
  • Publication number: 20070108579
    Abstract: Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
    Type: Application
    Filed: December 28, 2006
    Publication date: May 17, 2007
    Inventors: Todd Bolken, Chad Cobbley
  • Publication number: 20070063335
    Abstract: Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attached to the die, a protective casing covering a portion of the substrate, and a barrier projecting away from the surface of the substrate. The microelectronic die can have an integrated circuit and a plurality of bond-pads operatively coupled to the integrated circuit. The substrate can have a cap-zone defined by an area that is to be covered by the protective casing, a plurality of contact elements arranged in the cap-zone, a plurality of ball-pads arranged in a ball-pad array outside of the cap-zone, and a plurality of conductive lines coupling the contact elements to the ball-pads. The contact elements are electrically coupled to corresponding bond-pads on the microelectronic die, and the protective casing covers the cap-zone.
    Type: Application
    Filed: September 5, 2006
    Publication date: March 22, 2007
    Applicant: Micron Technology, Inc.
    Inventor: Chad Cobbley
  • Publication number: 20060290011
    Abstract: A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
    Type: Application
    Filed: August 31, 2006
    Publication date: December 28, 2006
    Applicant: Micro Technology Inc.
    Inventors: Chad Cobbley, Cary Baerlocher
  • Publication number: 20060267169
    Abstract: The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.
    Type: Application
    Filed: July 5, 2006
    Publication date: November 30, 2006
    Inventors: Todd Bolken, Chad Cobbley
  • Patent number: 7134390
    Abstract: A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: November 14, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Chad Cobbley, Ford B. Grigg
  • Publication number: 20060180907
    Abstract: Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In one aspect of the invention, a packaged microelectronic device includes a microelectronic die, an interconnecting unit coupled to the die, and a protective casing over the die. The interconnecting unit can have a substrate with a first side and a second side to which the die is attached, a plurality of contact elements operatively coupled to corresponding bond-pads on the die, and a plurality of ball-pads on the first side of the substrate electrically coupled to the contact elements. The protective casing can have at least a first cover encapsulating the die on the first side of the substrate. The packaged microelectronic device can also include a pressure relief element through at least a portion of the first cover and/or the substrate.
    Type: Application
    Filed: April 11, 2006
    Publication date: August 17, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Stephen James, Chad Cobbley
  • Publication number: 20060169490
    Abstract: Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
    Type: Application
    Filed: March 2, 2006
    Publication date: August 3, 2006
    Inventors: Todd Bolken, Cary Baerlocher, Steven Heppler, Chad Cobbley
  • Publication number: 20060068527
    Abstract: A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
    Type: Application
    Filed: November 16, 2005
    Publication date: March 30, 2006
    Applicant: Micron Technology Inc.
    Inventors: Chad Cobbley, Cary Baerlocher
  • Publication number: 20060063283
    Abstract: Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a die stack of at least two semiconductor die without attaching either of the at least two semiconductor die to a substrate. Further, present embodiments include testing the semiconductor die in the die stack after the die stack is formed and prior to attaching either of the at least two semiconductor die to the substrate.
    Type: Application
    Filed: November 4, 2005
    Publication date: March 23, 2006
    Inventors: Chad Cobbley, Timothy Jackson
  • Publication number: 20060055020
    Abstract: A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball grid arrays includes non-metal mateable alignment features. Each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays to from the vertically stacked memory package.
    Type: Application
    Filed: November 7, 2005
    Publication date: March 16, 2006
    Inventors: Todd Bolken, Cary Baerlocher, Chad Cobbley, David Corisis
  • Publication number: 20060051892
    Abstract: The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.
    Type: Application
    Filed: October 15, 2005
    Publication date: March 9, 2006
    Inventors: Todd Bolken, Chad Cobbley
  • Publication number: 20060051890
    Abstract: The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.
    Type: Application
    Filed: October 15, 2005
    Publication date: March 9, 2006
    Inventors: Todd Bolken, Chad Cobbley
  • Publication number: 20060051891
    Abstract: The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, a unitary shell of entirely transparent material is used. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.
    Type: Application
    Filed: October 15, 2005
    Publication date: March 9, 2006
    Inventors: Todd Bolken, Chad Cobbley
  • Publication number: 20060046351
    Abstract: The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound.
    Type: Application
    Filed: October 15, 2005
    Publication date: March 2, 2006
    Inventors: Todd Bolken, Chad Cobbley