Abstract: A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

Abstract: A device includes a first connector arranged to connect to an ink supply, a second connector arranged to connect to a print head, a first chamber arranged between the first and second connectors, the first chamber forming an ink path from the first connector to the second connector, a second chamber arranged adjacent to the first chamber, and a compliant wall between the first and second chambers. A system includes a print head, an ink tank connected to the print head, and a compliant wall device connected between the print head and the ink tank, the compliant wall device having a first chamber forming an ink path between the print head and the ink tank and a second chamber, the first and second chamber separated by a compliant wall.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: A device includes a first connector arranged to connect to an ink supply, a second connector arranged to connect to a print head, a first chamber arranged between the first and second connectors, the first chamber forming an ink path from the first connector to the second connector, a second chamber arranged adjacent to the first chamber, and a compliant wall between the first and second chambers. A system includes a print head, an ink tank connected to the print head, and a compliant wall device connected between the print head and the ink tank, the compliant wall device having a first chamber forming an ink path between the print head and the ink tank and a second chamber, the first and second chamber separated by a compliant wall.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

Abstract: An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.

Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Abstract: A system controls application of heat with a melt plate to an ink stick in a solid ink imaging device. The system includes a melt plate, a heater configured to heat the melt plate to a temperature sufficient to melt solid ink, a feed channel configured to direct solid ink sticks towards the melt plate to enable a leading edge of a solid ink stick to be melted by the heated melt plate, and a controller configured to separate the heater and the leading edge of the ink stick by a distance that arrest melting of the ink stick.

Abstract: A system has been developed that controls application of heat with a melt plate to an ink stick in a solid ink imaging device. The system includes a melt plate, a heater configured to heat the melt plate to a temperature sufficient to melt solid ink, a heat transfer unit configured to cool the melt plate to arrest the melting of the solid ink within a predetermined time, and a controller configured to actuate the heat transfer unit to selectively cool the melt plate in response to reaching a heater power off phase.

Abstract: A system controls application of heat with a melt plate to an ink stick in a solid ink imaging device. The system includes a melt plate, a heater configured to heat the melt plate to a temperature sufficient to melt solid ink, a feed channel configured to direct solid ink sticks towards the melt plate to enable a leading edge of a solid ink stick to be melted by the heated melt plate, and a controller configured to separate the heater and the leading edge of the ink stick by a distance that arrest melting of the ink stick.

Abstract: A system controls application of heat with a melt plate to an ink stick in a solid ink imaging device. The system includes a melt plate, a heater configured to heat the melt plate to a temperature sufficient to melt solid ink, a feed channel configured to direct solid ink sticks towards the melt plate to enable a leading edge of a solid ink stick to be melted by the heated melt plate, and a controller configured to separate the heater and the leading edge of the ink stick by a distance that arrest melting of the ink stick.

Abstract: A system has been developed that controls application of heat with a melt plate to an ink stick in a solid ink imaging device. The system includes a melt plate, a heater configured to heat the melt plate to a temperature sufficient to melt solid ink, a heat transfer unit configured to cool the melt plate to arrest the melting of the solid ink within a predetermined time, and a controller configured to actuate the heat transfer unit to selectively cool the melt plate in response to reaching a heater power off phase.

Abstract: A system controls application of heat with a melt plate to an ink stick in a solid ink imaging device. The system includes a melt plate, a heater configured to heat the melt plate to a temperature sufficient to melt solid ink, a feed channel configured to direct solid ink sticks towards the melt plate to enable a leading edge of a solid ink stick to be melted by the heated melt plate, and a controller configured to separate the heater and the leading edge of the ink stick by a distance that arrest melting of the ink stick.