Abstract: A method for reading pressure may include reading, by a first device, an acceleration of a pressure sensor, wherein the pressure sensor is encapsulated in a medium, and wherein the acceleration alters a reading of the pressure sensor and reading, by a second device, a pressure reading from the pressure sensor. If an output criteria is met, an adjusted pressure reading is produced. A system for reading pressure includes a first device coupled to the pressure sensor and configured to read an acceleration of the pressure sensor. A second device may be configured to read a pressure from the pressure sensor wherein, if an output criteria is met, to adjust the measured pressure of the pressure sensor, based on the measured acceleration, to produce an adjusted pressure reading. An output device is configured to receive an output of the second device and to output an output pressure reading.

Abstract: One example discloses a calibration device, including: a substrate; a torsional element; wherein a first end of the torsional element is coupled to the substrate; wherein a second end of the torsional element is moveable and defines a capacitance with the substrate; a bias electrode coupled to the substrate; wherein the torsional element and the bias electrode are positioned such that a bias voltage applied between the substrate and the bias electrode creates an electrostatic force between the bias electrode and the torsional element; wherein the electrostatic force causes movement between the torsional element and the substrate; and wherein the movement varies the capacitance.

Abstract: A device package includes a die that includes a substrate having first and second surfaces. A sensor is formed at a sensor region of the first surface. A trench extends entirely through the substrate between the first and second surfaces, in which the trench at least partially surrounds the sensor region. An isolation material, formed at the first surface, may extend across the trench A ring structure is coupled to the first surface of the substrate to create a first cavity in which the sensor is contained, the ring structure being laterally displaced away from and surrounding the sensor region and the trench. A molded compound body may abut an outer wall of the ring structure. The molded compound body has a second cavity that is concentric with the first cavity to enable fluid communication between the sensor and an environment external to the device package.

Abstract: A method for reading pressure may include reading, by a first device, an acceleration of a pressure sensor, wherein the pressure sensor is encapsulated in a medium, and wherein the acceleration alters a reading of the pressure sensor and reading, by a second device, a pressure reading from the pressure sensor. If an output criteria is met, an adjusted pressure reading is produced. A system for reading pressure includes a first device coupled to the pressure sensor and configured to read an acceleration of the pressure sensor. A second device may be configured to read a pressure from the pressure sensor wherein, if an output criteria is met, to adjust the measured pressure of the pressure sensor, based on the measured acceleration, to produce an adjusted pressure reading. An output device is configured to receive an output of the second device and to output an output pressure reading.

Abstract: A device package includes a die that includes a substrate having first and second surfaces. A sensor is formed at a sensor region of the first surface. A trench extends entirely through the substrate between the first and second surfaces, in which the trench at least partially surrounds the sensor region. An isolation material, formed at the first surface, may extend across the trench A ring structure is coupled to the first surface of the substrate to create a first cavity in which the sensor is contained, the ring structure being laterally displaced away from and surrounding the sensor region and the trench. A molded compound body may abut an outer wall of the ring structure. The molded compound body has a second cavity that is concentric with the first cavity to enable fluid communication between the sensor and an environment external to the device package.

Abstract: A pressure sensor device and a method for testing the pressure sensor device is provided. The pressure sensor device includes a first pressure sensor cell having a first capacitance value, and a second pressure sensor cell having a second capacitance value, the second capacitance value being different from the first capacitance value. In one embodiment, the method includes determining a temperature coefficient offset to test for faults in the pressure sensor device. In another embodiment, the method includes determining a differential mode calculation and a common mode calculation. A fault exists if the differential and common mode calculations do not agree.

Abstract: A sensor system includes first and second capacitive sensors. An excitation circuit, coupled with the sensors, applies an excitation voltage to each of the sensors. The excitation voltage is characterized by a first, second, and third excitation voltage components, wherein the second and third excitation voltage components have opposite polarities. A capacitance-to-voltage (C/V) converter, electrically coupled with the sensors, generates a differential-mode output signal in response to the first excitation voltage component applied to the sensors, and the C/V converter generates a common-mode output signal in response to the second and third excitation voltage components applied to the sensors.

Abstract: A method of testing includes attaching a first and second die to first and second die sites of a lead frame and forming a plurality of wire bonds coupling a plurality of pins of the first die site to the first die and a plurality of pins of the second die site to the second die. The first and second die are encapsulated. An isolation cut is performed to isolate the plurality of pins of the first die site from the plurality of pins of the second die site, while maintaining electrical connection between the first tie bar of the first die site and the first tie bar of the second die site. The first and second die are tested while providing a first power supply source to the first and second die via the first tie bars. After testing, the dies sites are fully singulated to result in packaged IC device.

Abstract: A pressure sensor device and a method for testing the pressure sensor device is provided. The pressure sensor device includes a first pressure sensor cell having a first capacitance value, and a second pressure sensor cell having a second capacitance value, the second capacitance value being different from the first capacitance value. In one embodiment, the method includes determining a temperature coefficient offset to test for faults in the pressure sensor device. In another embodiment, the method includes determining a differential mode calculation and a common mode calculation. A fault exists if the differential and common mode calculations do not agree.

Abstract: A structure for preventing charge induced leakage of a semiconductor device includes a shield separated from a first interconnect by at least a first lateral spacing and separated from a second interconnect by at least a second lateral spacing. The first interconnect is connected to a first junction and the second interconnect is connected to a second junction. A shield bias is connected to the shield to terminate an electromagnetic field on the shield. The shield between the first and second lateral spacings has a minimum width to substantially prevent formation of a conductive channel between the first and second junctions. The shield may be formed over a portion of the first junction and over a portion of the second junction to substantially prevent formation of another conductive channel between the first and second junctions at a location that does not have the first and second lateral spacings.

Abstract: A detector element for a microbolometer detector includes a platform structure spaced apart from a substrate. The platform structure has a peripheral region surrounding a central region. First and second contacts are located at the peripheral region proximate opposing first and third edges of the peripheral region. A stiff beam structure extends across the central region between the first and second contacts, and at least one sensor is located at the peripheral region proximate at least one of second and fourth edges of the peripheral region. An optically absorptive material structure of a grid pattern of first and second material portions may be located at the central region. First material portions perpendicular to the beam structure may connect to the beam structure and to inner edges of the peripheral region, and none of the second material portions extend continuously between and couples to opposing inner edges of the peripheral region.