Abstract: A heat sink includes a lower shell, an upper shell, and an internal matrix having a space. The space is configured to receive a phase change material. The lower shell, the upper shell and the internal matrix are formed as a single component using additive manufacturing techniques. The upper shell can include a fill port and a vent port. The fill port can be configured to provide a path into the space of the internal matrix for the phase change material. The fill port and the vent port can each be configured to receive a seal plug, such as an expansion plug.

Abstract: A heat sink is provided that includes a lower shell, an upper shell and an internal matrix. The lower shell, the upper shell and the internal matrix are formed as a single component using additive manufacturing techniques. The internal matrix includes a space that is configured to receive a phase change material.

Abstract: A heat sink is provided that includes a lower shell, an upper shell and an internal matrix. The lower shell, the upper shell and the internal matrix are formed as a single component using additive manufacturing techniques. The internal matrix includes a space that is configured to receive a phase change material.

Abstract: Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.

Abstract: A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device.

Abstract: A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device.

Abstract: Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.

Abstract: A cooling device for cooling a cooled surface includes a manifold having a number of inlet slots for directing fluid into an enclosed volume or chamber, toward the cooled surface. The manifold has a number of exit ports for receiving the fluid from the enclosed volume or chamber after it has impinged upon the cooled surface. The inlet slots and exit ports may be rectangular, or may be otherwise elongated, so as to provide substantially spatially uniform heat removal from the cooled surface. The cooling device may be used for a wide variety of applications, for example for cooling small devices such as integrated circuits or other devices involving electronics.