Abstract: Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase change material within the support structure; and melting the phase change material to reduce heat transfer from an external environment to the electronics assembly during a high temperature transient thermal condition.

Abstract: A system includes a pin assembly having a mating portion of a first axial cross-sectional area, a hilted portion of a second axial cross-sectional area, and a chamfered portion disposed between the mating portion and the hilted portion. The chamfered portion has third and fourth axial cross-sectional areas, and axially tapers at a first angle from the third cross-sectional area to the fourth cross-sectional area. A bushing assembly has a mating chamber and receiving port configured to receive the mating portion, and a countersink portion circumscribing the receiving port. The countersink portion has fifth and sixth axial cross-sectional areas, and axially tapers at a second angle from the fifth cross-sectional area to the sixth cross-sectional area. When the pin assembly and bushing assembly are mated, the countersink portion is configured to constrain radial movement, and movement in at least one axial direction, of the chamfered portion.

Abstract: Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase change material within the support structure; and melting the phase change material to reduce heat transfer from an external environment to the electronics assembly during a high temperature transient thermal condition.