Abstract: An electronic device having a thermal management system is provided. The thermal management system has a monolithic graphite element having a thickness of at least 150 microns. The graphite element has a thermal conductivity of at least about 700 W/mK. The graphite element is devoid of an internal adhesive, i.e., the graphite element is monolithic. The thermal management system is in operative contact with a heat source which comprises more than one electronic component. Preferably, the more than one electronic component is disposed on a stacked motherboard.

Abstract: Shielding articles are disclosed. One shielding article includes a fire retardancy element/fire propagation reduction element, which includes a pair of flexible graphite outer layers and a core, where the flexible graphite outer layers are on opposing sides of the core. The core may include one or more fire retardant elements or insulation materials. Also disclosed are battery packs that include the shielding articles. The shielding articles can be applied in any system that reduced fire propagation would be desirable.