Abstract: A method for processing flat articles with acoustical energy. The inventive system method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Abstract: A method for processing flat articles with acoustical energy. The inventive system method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Abstract: A system, apparatus and method for processing flat articles with acoustical energy. The inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system and/or method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Abstract: A system, apparatus and method for processing flat articles with acoustical energy. The inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system and/or method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Abstract: A system, apparatus and method for processing flat articles, such as semiconductor wafers, with acoustical energy. In a cleaning process, the inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system for processing flat articles comprising: a first dispenser for applying a liquid to a first surface of a flat article; a second dispenser for applying liquid to a second surface of a flat article; a first transducer assembly positioned so as to transmit acoustical energy to the first surface of the flat article; and a second transducer assembly positioned so as to transmit acoustical energy to the second surface of the flat article.

Abstract: A system, apparatus and method for processing this flat articles, such as semiconductor wafers, with acoustical energy. In a cleaning process, the inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively.