Abstract: A wireless field device is disclosed. The wireless field device includes an enclosure having a processor disposed within the enclosure. A power module may also be located inside the enclosure and be coupled to the processor. A wireless communication module is operably coupled to the processor and is configured to communicate using radio-frequency signals. An antenna is coupled to the wireless communication module. A radome mounted to the electronics enclosure is formed of a polymeric material. The radome has a chamber inside that contains the antenna.

Abstract: A wireless field device is disclosed. The wireless field device includes an enclosure having a processor disposed within the enclosure. A power module may also be located inside the enclosure and be coupled to the processor. A wireless communication module is operably coupled to the processor and is configured to communicate using radio-frequency signals. An antenna is coupled to the wireless communication module. A radome mounted to the electronics enclosure is formed of a polymeric material. The radome has a chamber inside that contains the antenna.

Abstract: A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

Abstract: An overpressure vent in a transmitter housing of a process transmitter. The transmitter is configured for coupling to an industrial process and measuring a process variable. The transmitter includes an enclosure having a cavity formed therein. A process coupling is configured to couple the cavity to the industrial process. The overpressure vent is arranged to vent an overpressure in the cavity to outside of the transmitter enclosure.

Abstract: A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

Abstract: A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

Abstract: A pressure transmitter assembly for measuring a pressure of a process fluid includes an isolation diaphragm assembly. A pressure sensor is spaced apart from the isolation diaphragm assembly to provide thermal isolation. A conduit extends from the isolation diaphragm assembly to the pressure sensor and is configured to carry isolation fill fluid.