Abstract: Method and apparatus for splitting an aerosol flow into multiple streams prior to deposition. The aerosol flow is surrounded in each outlet by a sheath gas flow. Adjusting the sheath gas flow in each outlet determines the amount, if any, of aerosol transported through each of the outlets. For example, the sheath flow in an outlet may be increased until all of the aerosol flow through that outlet is diverted to one or more other outlets. One of the outlets can be an exhaust outlet, which can exhaust all of the aerosol produced by the system if the aerosol flows in the other outlets are stopped, thus preventing material settling and, in combination with increasing the sheath gas flows in the other outlets, enables fast shuttering rates. The sheath gas prevents the aerosolized material from building up on the bottom of the splitter chamber and inside the outlets.

Abstract: An apparatus and method for depositing an aerosol that has an ultrafast pneumatic, shutter. The flow of aerosol through the entire deposition flow path is surrounded by at least one sheath gas, thereby greatly increasing reliability. The distance between the aerosol switching chamber and a reverse gas flow chamber input is minimized to reduce switching time. The distance from the switching chamber to the nozzle exit is also minimized to reduce switching time. The gas flows in the system are configured to maintain a substantially constant pressure in the system, and consequently substantially constant flow rates through the deposition nozzle and exhaust nozzle, to minimize on/off switching times. This enables the system to have a switching time of less than 10 ms.

Abstract: An apparatus and method for depositing an aerosol that has an ultrafast pneumatic, shutter. The flow of aerosol through the entire deposition flow path is surrounded by at least one sheath gas, thereby greatly increasing reliability. The distance between the aerosol switching chamber and a reverse gas flow chamber input is minimized to reduce switching time. The distance from the switching chamber to the nozzle exit is also minimized to reduce switching time. The gas flows in the system are configured to maintain a substantially constant pressure in the system, and consequently substantially constant flow rates through the deposition nozzle and exhaust nozzle, to minimize on/off switching times. This enables the system to have a switching time of less than 10 ms.

Abstract: The present invention provides deposition sources, systems, and related methods that can efficiently and controllably provide vaporized material for deposition of thin-film materials. The deposition sources, systems and related methods described herein can be used to deposit any desired material and are particularly useful for depositing high vapor pressure materials such as selenium in the manufacture of copper indium gallium diselenide based photovoltaic devices.

Abstract: The present invention provides deposition sources, systems, and related methods that can efficiently and controllably provide vaporized material for deposition of thin-film materials. The deposition sources, systems and related methods described herein can be used to deposit any desired material and are particularly useful for depositing high vapor pressure materials such as selenium in the manufacture of copper indium gallium diselenide based photovoltaic devices.

Abstract: Vapor depositions sources, systems, and related deposition methods. Vapor deposition sources for use with materials that evaporate or sublime in a difficult to control or otherwise unstable manner are provided. The present invention is particularly applicable to deposition of organic material such as those for forming one or more layer in organic light emitting devices.

Abstract: Vapor depositions sources, systems, and related deposition methods. Vapor deposition sources for use with materials that evaporate or sublime in a difficult to control or otherwise unstable manner are provided. The present invention is particularly applicable to deposition of organic material such as those for forming one or more layer in organic light emitting devices.