Patents by Inventor Chad O. SIMPSON

Chad O. SIMPSON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11956898
    Abstract: Structures that implement three-dimensional (3D) conductive material (e.g., copper) in printed circuit boards (PCBs) are disclosed. 3D (three-dimensional) conductive material may include trenches and/or buried vias that are filled with conductive material in the PCBs. Trenches may be formed in build-up layers of a PCB by overlapping multiple laser drilled vias. The trenches may be filled with conductive material using electroplating process(es). Buried vias may be formed through the core layers of the PCB by mechanical drilling. The buried via may be filled with solid conductive material using a combination of electroless plating and electrolytic plating of conductive material. Various PCB structures are disclosed that implement combinations of these trenches and/or these buried vias filled with conductive material.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 9, 2024
    Assignee: Apple Inc.
    Inventors: Anne M. Mason, Chad O. Simpson, William Hannon, Mark J. Beesley
  • Publication number: 20220095455
    Abstract: Structures that implement three-dimensional (3D) conductive material (e.g., copper) in printed circuit boards (PCBs) are disclosed. 3D (three-dimensional) conductive material may include trenches and/or buried vias that are filled with conductive material in the PCBs. Trenches may be formed in build-up layers of a PCB by overlapping multiple laser drilled vias. The trenches may be filled with conductive material using electroplating process(es). Buried vias may be formed through the core layers of the PCB by mechanical drilling. The buried via may be filled with solid conductive material using a combination of electroless plating and electrolytic plating of conductive material. Various PCB structures are disclosed that implement combinations of these trenches and/or these buried vias filled with conductive material.
    Type: Application
    Filed: December 11, 2020
    Publication date: March 24, 2022
    Inventors: Anne M. Mason, Chad O. Simpson, William Hannon, Mark J. Beesley
  • Patent number: 10191535
    Abstract: The embodiments discussed herein relate to systems, methods, and apparatus for controlling power consumption of a computing device in a standby or sleep mode. During the standby or sleep mode an external device can be plugged into the computing device. The external device can be provided power from a standby power supply until a determination is made as to whether a main power supply is operating. The determination can be based on comparing the output of the main power supply to an output of the standby power supply. If the main power supply is operating, a switch in the computing device can close to allow the main power supply to provide power to the external device. Moreover, in some embodiments, the switch can close based exclusively on a current demand of the external device from the standby power supply.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: January 29, 2019
    Assignee: Apple Inc.
    Inventors: Adrian E. Sun, Bharat K. Patel, Erik A. Gutfeldt, Mark K. Sin, Kim Phuong T. Truong, Steve Xing-Fu Zhou, Asif Iqbal, Paul S. Michelsen, Lee M. Schaff, Steven Ichung Kuo, Chad O. Simpson, Derrick C. Lau
  • Publication number: 20150106638
    Abstract: The embodiments discussed herein relate to systems, methods, and apparatus for controlling power consumption of a computing device in a standby or sleep mode. During the standby or sleep mode an external device can be plugged into the computing device. The external device can be provided power from a standby power supply until a determination is made as to whether a main power supply is operating. The determination can be based on comparing the output of the main power supply to an output of the standby power supply. If the main power supply is operating, a switch in the computing device can close to allow the main power supply to provide power to the external device. Moreover, in some embodiments, the switch can close based exclusively on a current demand of the external device from the standby power supply.
    Type: Application
    Filed: October 13, 2014
    Publication date: April 16, 2015
    Inventors: Adrian E. SUN, Bharat K. PATEL, Erik A. GUTFELDT, Mark K. SIN, Kim Phuong T. TRUONG, Steve Xing-Fu ZHOU, Asif IQBAL, Paul S. MICHELSEN, Lee M. SCHAFF, Steven Ichung KUO, Chad O. SIMPSON, Derrick C. LAU