Patents by Inventor Cha Doh

Cha Doh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10981117
    Abstract: A thermoplastic blended potting resin, a blended resin potted membrane, a membrane separation module, a fluid separation device, a method of making and a method of using the membrane separation module and the fluid separation device are described herein. The blended thermoplastic potting resin comprises at least one polar membrane having two end regions and a middle region; and a blended resin comprising a non-polar thermoplastic polymer and a polar thermoplastic polymer; wherein at least one of the two ends regions is coated with the blended potting resin to form a fluid-tight seal between the end regions and the open middle region, and wherein the polar thermoplastic polymer is 1% or greater by weight of blended resin.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 20, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Ganapathysubramanian Iyer, Cha Doh
  • Publication number: 20180200676
    Abstract: A thermoplastic blended potting resin, a blended resin potted membrane, a membrane separation module, a fluid separation device, a method of making and a method of using the membrane separation module and the fluid separation device are described herein. The blended thermoplastic potting resin comprises at least one polar membrane having two end regions and a middle region; and a blended resin comprising a non-polar thermoplastic polymer and a polar thermoplastic polymer; wherein at least one of the two ends regions is coated with the blended potting resin to form a fluid-tight seal between the end regions and the open middle region, and wherein the polar thermoplastic polymer is 1% or greater by weight of blended resin.
    Type: Application
    Filed: June 30, 2016
    Publication date: July 19, 2018
    Inventors: Ganapathysubramanian Iyer, Cha Doh
  • Publication number: 20070144716
    Abstract: The present invention relates to potted exchange devices including hollow conduits and or hollow porous membranes wherein the housing includes recessed channels or grooves. The recessed channels or grooves are filled by the potting material during the potting process and form a unitary end structure with the potting material. The grooves or channels formed on the inside of the housing maintains the integrity of the potting with the housing under a wide range of mechanical and thermal conditions.
    Type: Application
    Filed: December 21, 2004
    Publication date: June 28, 2007
    Inventors: Cha Doh, Joseph Smith