Patents by Inventor Chad R. Binkerd

Chad R. Binkerd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Prevention of slurry build-up within wafer topography during polishing
    Patent number: 6455434
    Abstract: The present invention provides a method of preventing the build-up of polishing material within low areas of a substrate during polishing. Following the blanket deposition of a first layer, a selectively removable material is deposited over the first layer, wherein the selectively removable material fills the low areas. A surface of the substrate is polished removing the excess first layer and selectively removable material from the surface, leaving the first layer and selectively removable material within the low area. Following polishing, the selectively removable material is removed from the low areas prior to the deposition of a second layer.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: September 24, 2002
    Assignee: International Business Machines Corporation
    Inventors: Chad R. Binkerd, Jose L. Cruz, Timothy C. Krywanczyk, Brian D. Pfeifer, Rosemary A. Previti-Kelly, Patricia Schink, Amye L. Wells