Abstract: A thermal conditioning system for conditioning a seat surface of a vehicle or other surface. The system includes a thermoelectric Peltier device with a main side and a waste side. A flap adjusts a proportion of an airflow between a main side airflow path and a waste side airflow path based on whether the surface is occupied, the power provided the thermoelectric Peltier device, the flow rates along the airflow paths, the power provided to a blower, and/or other factors.

Abstract: Method, apparatus, and systems for roll angle estimation for an input/gesture device (IGD) are disclosed. The method includes estimating a first axis vector of the input/gesture device (IGD) relative to the surface of the mobile device (MD), as a first frame of reference, using readings from a first type of sensor; and estimating the first axis vector of the IDG relative to a different, second frame of reference using a gyroscope integration of readings from the 3-axis gyroscope. The method further includes aligning the first axis vector of the IDG in the first frame of reference with the first axis vector of the IDG in the second frame of reference; minimizing a change in the alignment of the first axis vectors between the first frame of reference and the second frame of reference; and determining the roll angle of the IDG relative to the surface of the MD.

Abstract: Production test of integrated circuit face thermal management challenges with higher power devices. Current production handlers do not have adequate thermal management characteristics. This invention employs thermal diodes on each device under test and a closed loop microprocessor controlled feedback system for thermal control during production test. The feedback system controls the open/close state of a valve supplying cooling fluid to bathe the integrated circuit based upon the difference between a temperature indicated by at least one thermal diode and a set point temperature.

Abstract: Production test of integrated circuit face thermal management challenges with higher power devices. Current production handlers do not have adequate thermal management characteristics. This invention employs thermal diodes on each device under test and a closed loop microprocessor controlled feedback system for thermal control during production test.