Abstract: An atomization assembly for heating a metal includes a copper crucible arranged to hold the metal, a copper nozzle extending beneath the copper crucible, a heating coil extending around the copper crucible and the copper nozzle, and a cooling system in thermal communication with at least one of the copper crucible or the copper nozzle.

Abstract: An atomization assembly includes: a crucible; a copper nozzle extending beneath the copper crucible configured to receive a metal from the copper crucible; a cooling system in fluid communication with one or more cooling passages of the copper nozzle during operation of the atomization assembly in a production mode; wherein, during operation of the atomization assembly in the production mode: the atomization assembly defines an energy conversion factor (ECF) greater than or equal to 1% (0.01) and less than or equal to 30% (0.30).

Abstract: An atomization assembly for heating a metal includes a copper crucible arranged to hold the metal, a copper nozzle extending beneath the copper crucible, the copper nozzle defining a downstream end, a side surface, an outer surface, and a groove extending from the side surface to the outer surface at the downstream end, a cooling system in thermal communication with the copper crucible and the copper nozzle, and an atomization fluid supply including an outlet disposed adjacent to the groove.

Abstract: An atomization assembly for heating a metal includes a copper crucible arranged to hold the metal, a copper nozzle extending beneath the copper crucible, the copper nozzle defining a downstream end and an outer surface, an annular plate defining an aperture, the aperture disposed beneath the copper nozzle, a cooling system in thermal communication with the annular plate, and an atomization fluid supply oriented to direct an atomization gas into the aperture.

Abstract: Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant via a heat transfer surface to transfer heat generated by the IC to the coolant. The heat transfer surface has a porous surface exhibiting a gradient of porosity and/or particle size along at least one direction of the heat transfer surface.

Abstract: Traditional air cooled fin heat sinks, which contain heat pipes, are generally able to evacuate the heat adequately from electronic devices at low power. However, some restrictions like a high thermal resistance at high powers and an early dry-out limit their usage in new generations of CPU and GPU. The present disclosure relates to a porous coating capable of increasing the thermal performance of data processors. The coating can be applied to after-market off-the-shelf processors and increase the thermal performance in pool boiling applications. The coating can be a multi-scale electroplated porous (MuSEP) coating that increases boiling efficiency.

Abstract: Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant via a heat transfer surface to transfer heat generated by the IC to the coolant. The heat transfer surface has a porous surface exhibiting a gradient of porosity and/or particle size along at least one direction of the heat transfer surface.