Abstract: Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant via a heat transfer surface to transfer heat generated by the IC to the coolant. The heat transfer surface has a porous surface exhibiting a gradient of porosity and/or particle size along at least one direction of the heat transfer surface.

Abstract: Traditional air cooled fin heat sinks, which contain heat pipes, are generally able to evacuate the heat adequately from electronic devices at low power. However, some restrictions like a high thermal resistance at high powers and an early dry-out limit their usage in new generations of CPU and GPU. The present disclosure relates to a porous coating capable of increasing the thermal performance of data processors. The coating can be applied to after-market off-the-shelf processors and increase the thermal performance in pool boiling applications. The coating can be a multi-scale electroplated porous (MuSEP) coating that increases boiling efficiency.

Abstract: Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant via a heat transfer surface to transfer heat generated by the IC to the coolant. The heat transfer surface has a porous surface exhibiting a gradient of porosity and/or particle size along at least one direction of the heat transfer surface.