Patents by Inventor Chae-Jun Lee

Chae-Jun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220293564
    Abstract: A stack package, and a method of manufacturing the same, includes a first encapsulant layer formed on a carrier. Also semiconductor dies are sequentially offset stacked on the first encapsulant layer. Vertical connectors connected to the semiconductor dies are formed. A second encapsulant layer coupled to the first encapsulant layer is formed to encapsulate the vertical connectors and the semiconductor dies. Redistribution layers connected to the vertical connectors are formed on the second encapsulant layer.
    Type: Application
    Filed: September 8, 2021
    Publication date: September 15, 2022
    Applicant: SK hynix Inc.
    Inventors: Ki Jun SUNG, Chae Sung LEE
  • Patent number: 11444063
    Abstract: A semiconductor package may include: at least one semiconductor chip disposed such that an active surface on which a plurality of chip pads are disposed faces a redistribution conductive layer; a plurality of vertical interconnectors, each with one end connected to a respective chip pad, extending in a vertical direction toward the redistribution conductive layer; a molding layer covering the semiconductor chip and the vertical interconnectors while exposing an other end of each of the vertical interconnectors that is not connected to the chip pad; a plurality of landing pads disposed over the molding layer, and each connected to the other end of each of the vertical interconnectors; a redistribution insulating layer covering the molding layer with an opening that collectively exposes the landing pads; and the redistribution conductive layer that extends over the molding layer and the redistribution insulating layer while being connected to each of the landing pads.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: September 13, 2022
    Assignee: SK hynix Inc.
    Inventors: Ki Jun Sung, Chae Sung Lee
  • Publication number: 20220230994
    Abstract: A semiconductor package may include: at least one semiconductor chip disposed such that an active surface on which a plurality of chip pads are disposed faces a redistribution conductive layer; a plurality of vertical interconnectors, each with one end connected to a respective chip pad, extending in a vertical direction toward the redistribution conductive layer; a molding layer covering the semiconductor chip and the vertical interconnectors while exposing an other end of each of the vertical interconnectors that is not connected to the chip pad; a plurality of landing pads disposed over the molding layer, and each connected to the other end of each of the vertical interconnectors; a redistribution insulating layer covering the molding layer with an opening that collectively exposes the landing pads; and the redistribution conductive layer that extends over the molding layer and the redistribution insulating layer while being connected to each of the landing pads.
    Type: Application
    Filed: May 5, 2021
    Publication date: July 21, 2022
    Applicant: SK hynix Inc.
    Inventors: Ki Jun SUNG, Chae Sung LEE
  • Patent number: 9728862
    Abstract: A wireless communication system provides an antenna apparatus for the wireless communication system. The antenna apparatus includes a base, a plurality of Yagi-Uda antenna modules disposed in a specific arrangement, a plurality of floating metal modules correspondingly installed in upper portions of the Yagi-Uda antenna modules and selectively connected to a corresponding Yagi-Uda module among the plurality of Yagi-Uda antenna modules, a switching element for selectively switching the floating metal module and the Yagi-Uda antenna module, and a controller for controlling the Yagi-Uda antenna module to comprise a directivity in a desired direction by selectively switching the switching element.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: August 8, 2017
    Assignees: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, SAMSUNG ELECTRONICS CO., LTD
    Inventors: Won-Suk Choi, Chul-Soon Park, In-Sang Song, Inn-Yeal Oh, Joong-Ho Lee, Chae-Jun Lee
  • Publication number: 20170141472
    Abstract: Disclosed is a millimeter wave antenna for diagonal radiation. A first metal layer and a second metal layer having a form of microstrip wire are coated on the bottom surface and at least a partial region of the top surface of a dielectric substrate, respectively. When viewed in a direction perpendicular to the top surface of the dielectric substrate, the second metal layer is covered by the first metal layer. The microstrip wire of the second metal layer may have a length of more than half of a wavelength of a RF signal. The long-wire antenna has a radiation pattern in upward diagonal direction when a signal to transmit is fed under a condition that the first metal layer is grounded. The form of the second metal layer may be a straight line, Y-shape, ?-shape, or etc. An impedance matching metal layer may be added to the second metal layer.
    Type: Application
    Filed: January 26, 2016
    Publication date: May 18, 2017
    Inventors: Chul-Soon PARK, Tae-Hwan JANG, Hong-Yi KIM, Chae-Jun LEE
  • Patent number: 9407007
    Abstract: An antenna device in a wireless communication includes antenna wires of four sides which include three feeding points and have a loop structure and four main switches which are located among the antenna wires of the four sides, wherein the antenna device operates as a loop antenna when the antenna wires of the four sides are connected according to operations of the main switches and wherein the antenna device operates as dipole antennas when the antenna wires of the four sides are disconnected according to operations of the main switches.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 2, 2016
    Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology
    Inventors: Duck-Dong Hwang, Chul-Soon Park, In-Sang Song, Inn-Yeal Oh, Chae-Jun Lee
  • Patent number: 9319256
    Abstract: An OOK modulation device according to the present inventive concept includes: an oscillator outputting a first frequency signal in which the frequency varies according to an input voltage; a frequency multiplier switching unit operating according to an OOK input data and switching on/off a second frequency signal that is obtained by multiplying the first frequency signal; and a switching amplifying unit amplifying and switching the second frequency signal according to the OOK input data to output an OOK modulation signal.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: April 19, 2016
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Chul Soon Park, Chul Woo Byeon, Chae Jun Lee, Chong Hyun Yoon, Joong Ho Lee, Seong Jun Cho, Hong Yi Kim, In Sang Song
  • Publication number: 20150256369
    Abstract: An OOK modulation device according to the present inventive concept includes: an oscillator outputting a first frequency signal in which the frequency varies according to an input voltage; a frequency multiplier switching unit operating according to an OOK input data and switching on/off a second frequency signal that is obtained by multiplying the first frequency signal; and a switching amplifying unit amplifying and switching the second frequency signal according to the OOK input data to output an OOK modulation signal.
    Type: Application
    Filed: September 6, 2013
    Publication date: September 10, 2015
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chul Soon Park, Chul Woo Byeon, Chae Jun Lee, Chong Hyun Yoon, Joong Ho Lee, Seong Jun Cho, Hong Yi Kim, In Sang Song
  • Publication number: 20140225794
    Abstract: A wireless communication system provides an antenna apparatus for the wireless communication system. The antenna apparatus includes a base, a plurality of Yagi-Uda antenna modules disposed in a specific arrangement, a plurality of floating metal modules correspondingly installed in upper portions of the Yagi-Uda antenna modules and selectively connected to a corresponding Yagi-Uda module among the plurality of Yagi-Uda antenna modules, a switching element for selectively switching the floating metal module and the Yagi-Uda antenna module, and a controller for controlling the Yagi-Uda antenna module to comprise a directivity in a desired direction by selectively switching the switching element.
    Type: Application
    Filed: December 9, 2013
    Publication date: August 14, 2014
    Applicants: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, SAMSUNG ELECTRONICS CO., LTD
    Inventors: Won-Suk Choi, Chul-Soon Park, In-Sang Song, Inn-Yeal Oh, Joong-Ho Lee, Chae-Jun Lee
  • Publication number: 20130241782
    Abstract: An antenna device in a wireless communication includes antenna wires of four sides which include three feeding points and have a loop structure and four main switches which are located among the antenna wires of the four sides, wherein the antenna device operates as a loop antenna when the antenna wires of the four sides are connected according to operations of the main switches and wherein the antenna device operates as dipole antennas when the antenna wires of the four sides are disconnected according to operations of the main switches.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 19, 2013
    Applicants: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, SAMSUNG ELECTRONICS CO., LTD
    Inventors: Duck-Dong Hwang, Chul-Soon Park, In-Sang Song, Inn-Yeal Oh, Chae-Jun Lee