Abstract: A volatile memory device and a nonvolatile memory device are provided. Provided is a plurality of gate electrodes and a plurality of insulating patterns alternately stacked on top of each other in a first direction, an information storage film formed along a sidewall of a trench, wherein the trench extends through the plurality of gate electrodes and the insulating patterns in the first direction, and a semiconductor pattern formed on the information storage film, wherein the semiconductor pattern is made of polycrystalline silicon composed of a first monocrystalline silicon and a second monocrystalline silicon, wherein a metal silicide is present in a grain boundary between the first monocrystalline silicon and the second monocrystalline silicon, wherein the metal silicide is absent in each of the first monocrystalline silicon and the second monocrystalline silicon except for the grain boundary therebetween.

Abstract: A multilayer ceramic electronic component includes a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode disposed on one of the third and fourth surfaces and extending onto the first and second surfaces of. A relational expression of 0.9?A/BW<1.0 is satisfied, where a shortest distance, in the second direction, from an end portion of the ceramic body which the external electrode is disposed at to an end portion of the external electrode disposed on one of the first and second surfaces, is denoted by “A”, and a longest distance, in the second direction, from the end portion of the ceramic body to the end portion of the external electrode, is denoted by “BW”.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is a, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is b, b/a is 0.07 or more.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is ‘a’, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is ‘b’, ‘b/a’ is 0.07 or more.

Abstract: A multilayer electronic component includes a body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and first and second surfaces opposing each other in a direction by which the internal electrodes are laminated, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer disposed on at least one surface of any one of the first, second, fifth, or sixth surface and containing a rare-earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.

Abstract: A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 ?m or more.

Abstract: A multilayer electronic component includes a body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and first and second surfaces opposing each other in a direction by which the internal electrodes are laminated, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer disposed on at least one surface of anyone of the first, second, fifth, or sixth surface and containing a rare-earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.

Abstract: A multilayer ceramic electronic component includes a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode disposed on one of the third and fourth surfaces and extending onto the first and second surfaces of. A relational expression of 0.9?A/BW<1.0 is satisfied, where a shortest distance, in the second direction, from an end portion of the ceramic body which the external electrode is disposed at to an end portion of the external electrode disposed on one of the first and second surfaces, is denoted by “A”, and a longest distance, in the second direction, from the end portion of the ceramic body to the end portion of the external electrode, is denoted by “BW”.

Abstract: A multilayer ceramic electronic component includes a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode disposed on one of the third and fourth surfaces and extending onto the first and second surfaces of. A relational expression of 0.9?A/BW<1.0 is satisfied, where a shortest distance, in the second direction, from an end portion of the ceramic body which the external electrode is disposed at to an end portion of the external electrode disposed on one of the first and second surfaces, is denoted by “A”, and a longest distance, in the second direction, from the end portion of the ceramic body to the end portion of the external electrode, is denoted by “BW”.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes forming a water-repellent coating layer on surfaces of a multilayer ceramic capacitor having an internal electrode, a dielectric layer, and an external electrode; and removing at least a portion of the water-repellent coating layer formed on the surfaces of the external electrode such that another portion of the water-repellent coating layer remains on surfaces of the dielectric layer. The external electrode has first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a length direction.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is a, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is b, b/a is 0.07 or more.

Abstract: A multilayer ceramic electronic component includes a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode disposed on one of the third and fourth surfaces and extending onto the first and second surfaces of. A relational expression of 0.9?A/BW<1.0 is satisfied, where a shortest distance, in the second direction, from an end portion of the ceramic body which the external electrode is disposed at to an end portion of the external electrode disposed on one of the first and second surfaces, is denoted by “A”, and a longest distance, in the second direction, from the end portion of the ceramic body to the end portion of the external electrode, is denoted by “BW”.

Abstract: A multilayer electronic component includes a body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and first and second surfaces opposing each other in a direction by which the internal electrodes are laminated, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer disposed on at least one surface of anyone of the first, second, fifth, or sixth surface and containing a rare-earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.

Abstract: In a method of manufacturing a multilayer ceramic capacitor, and a multilayer ceramic capacitor manufactured by the same, moisture resistance at a junction between a ceramic body and an external electrode may be improved and excellent substrate mounting properties may be provided.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with the respective dielectric layers disposed therebetween, and first and second external electrodes disposed on first and second external surfaces of the ceramic body to be connected to corresponding internal electrodes, respectively. A longest distance from the first external electrode to the second external electrode is denoted by La, a shortest distance from the first external electrode to the second external electrode is denoted by Lb, and Lb/La is greater than zero to 0.6 or less.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers, and a water repellent layer including a portion disposed to cover a gap between the ceramic body and the first and second plating layers, having a first thickness and a portion disposed to cover a surface of the ceramic body, to having a second thickness, smaller than the first thickness.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.

Abstract: Generally, Reed-Solomon encoding process in the conventional communication system is executed by a Reed-Solomon encoder having different code rates for different data transmission rates. The present invention does not use a Reed-Solomon encoder having different coding rates, but instead uses a Reed-Solomon encoder having the same code rate regardless of data transmission rate. Accordingly, the present invention has the following effects. The present invention maintains same communication quality regarding data services having each different data transmission rate, and can use a single Reed-Solomon encoder.