Abstract: Disclosed is an entropy-controlled solid solution matrix BCC alloy having strong resistance to high-temperature neutron radiation damage. The entropy-controlled solid solution matrix BCC alloy includes three or more multicomponent main elements selected from the element group consisting of Zr, Al, Nb, Mo, Cr, V, and Ti selected based on a neutron absorption cross-sectional area and a mixing enthalpy. Each of the elements is included in an amount of 5 to 35 at %, and the entropy-controlled solid solution matrix BCC alloy is a BCC-structure solid solution matrix alloy in a medium-entropy to high-entropy state. In this invention, damage caused by neutron radiation is reduced, and entropy is controlled to thus ensure a solid solution matrix BCC structure having a slow diffusion speed, and accordingly, resistance to void swelling due to radioactive rays is high.

Abstract: The present invention relates to a high entropy alloy having more improved mechanical properties by controlling contents of additive elements in a NiCoFeMnCr 5-element alloy to control stacking fault energy, thereby controlling stability of a ? austenite phase to control a transformation mechanism, wherein the stacking fault energy is controlled in a composition range of NiaCobFecMndCre (a+b+c+d+e=100, 1?a?50, 1?b?50, 1?c?50, 1?d?50, 10?e?25, and 77a?42b?22c+73d?100e+2186?1500), and thus, the ? austenite phase exhibits a twin-induced plasticity (TWIP) property or a transformation induced-plasticity (TRIP) property in which the ? austenite phase is subjected to phase transformation into an ? martensite phase or an ?? martensite phase, under stress, thereby having improved strength and elongation at the same time to have excellent mechanical properties.

Abstract: The present invention relates to a high entropy alloy having more improved mechanical properties by controlling contents of additive elements in a NiCoFeMnCr 5-element alloy to control stacking fault energy, thereby controlling stability of a ? austenite phase to control a transformation mechanism, wherein the stacking fault energy is controlled in a composition range of NiaCobFecMndCre (a+b+c+d+e=100, 1?a?50, 1?b?50, 1?c?50, 1?d?50, 10?e?25, and 77a?42b?22c+73d?100e+2186?1500), and thus, the ? austenite phase exhibits a twin-induced plasticity (TWIP) property or a transformation induced-plasticity (TRIP) property in which the ? austenite phase is subjected to phase transformation into an ? martensite phase or an ?? martensite phase, under stress, thereby having improved strength and elongation at the same time to have excellent mechanical properties.

Abstract: Disclosed is an entropy-controlled solid solution matrix BCC alloy having strong resistance to high-temperature neutron radiation damage. The entropy-controlled solid solution matrix BCC alloy includes three or more multicomponent main elements selected from the element group consisting of Zr, Al, Nb, Mo, Cr, V, and Ti selected based on a neutron absorption cross-sectional area and a mixing enthalpy. Each of the elements is included in an amount of 5 to 35 at %, and the entropy-controlled solid solution matrix BCC alloy is a BCC-structure solid solution matrix alloy in a medium-entropy to high-entropy state. In this invention, damage caused by neutron radiation is reduced, and entropy is controlled to thus ensure a solid solution matrix BCC structure having a slow diffusion speed, and accordingly, resistance to void swelling due to radioactive rays is high.

Abstract: Disclosed herein is a flexible substrate, made of metallic glass that is of high resilience suitable for use in electronic devices. The metallic glass is composed of a commercial alloy that can be produced in a continuous process on a mass scale, and may be selected from among Mg-, Ca-, Al-, Ti-, Zr-, Hf-, Fe-, Co-, Ni-, and Cu-based metallic glass. Preferably, its crystallization temperature, which determines the process allowable temperature, is 200° C. or higher. The flexible metallic glass substrate exhibits excellent fatigue properties as well as resilience of 1.5 MJ/m3 or higher. Its coefficient of thermal expansion is within a small range of 1 to 20 ppm/° C., so that the flexible metallic glass substrate shows a better interfacial property with electronic devices.