Abstract: The present invention relates to a battery pack system. In the battery pack system including a multi-battery according to the present invention, replacement may be easily performed in a lower unit of the battery pack system, the battery pack system including a multi-battery may include the battery modules having various forms and performances and capable of being arranged so as to increase space efficiency of the battery pack system, the battery pack system including a multi-battery includes the battery modules having various forms and performances, such that an energy density of the battery pack system may be improved, and the battery pack system including a multi-battery may allow battery modules having various performances and outputs to maintain states of charge (SOCs) (%) in a uniform ratio by estimating the SOCs of the respective battery modules and re-scaling the SOCs according to a capacity criterion of a control unit.

Abstract: The present invention relates to a battery pack system. In the battery pack system including a multi-battery according to the present invention, replacement may be easily performed in a lower unit of the battery pack system, the battery pack system including a multi-battery may include the battery modules having various forms and performances and capable of being arranged so as to increase space efficiency of the battery pack system, the battery pack system including a multi-battery includes the battery modules having various forms and performances, such that an energy density of the battery pack system may be improved, and the battery pack system including a multi-battery may allow battery modules having various performances and outputs to maintain states of charge (SOCs) (%) in a uniform ratio by estimating the SOCs of the respective battery modules and re-scaling the SOCs according to a capacity criterion of a control unit.

Abstract: Disclosed is a coaxial probe comprising, an internal conductor comprising an upper contact configured to contact a semiconductor device; a lower contact configured to contact a tester for testing the semiconductor device; and an internal elastic member configured to elastically bias at least one of the upper and lower contacts to make the upper and lower contacts distant from each other; an external conductor configured to surround the internal conductor; a plurality of gap members which is respectively inserted into opposite ends between the internal conductor and the external conductor to create a predetermined air gap between the internal conductor and the external conductor; and at least one external elastic member that is inserted into an external circumferential surface of the external conductor to elastically bias at least one of the semiconductor device and the tester to a direction that makes either the semiconductor device or the test distant from the external conductor.

Abstract: Disclosed is an inspection apparatus for a semiconductor device, which is to inspect an electric characteristic of an inspective object having a plurality of electric inspective contact points. The inspection apparatus includes a socket assembly which includes a plurality of probe pins retractable in a longitudinal direction, a probe pin supporter supporting the probe pins in parallel with each other, and a socket board including a plurality of fixed contact points a first end portion of the probe pins, and an inspective object carrier which includes an inspective object accommodating portion accommodating the inspective object so that the inspective contact points face toward a second end portion of the probe pins, and a floor member interposed between the inspective object and the probe pin supporter and including probe holes penetrated corresponding to the inspective contact points and passing the second end portion of the probe pin therethrough.

Abstract: Disclosed is a probe which stably transmits a test signal. The probe electrically connects a semiconductor device and a tester for testing the semiconductor device. The probe may include an upper plunger which is configured to be electrically connected to the semiconductor device; a lower plunger which is configured to be electrically connected to the tester; an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other; a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; and a barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member.

Abstract: Disclosed are a test probe and a machining method of a test probe, the test probe including a plunger end part contacting a tested contact point, the plunger end part including a plurality of tips protruding toward the tested contact point, and at least one of the plurality of tips is a higher tip and at least another one of the plurality of tips is a lower tip that is lower than the higher tip.

Abstract: Disclosed is a coaxial probe comprising, an internal conductor comprising an upper contact configured to contact a semiconductor device; a lower contact configured to contact a tester for testing the semiconductor device; and an internal elastic member configured to elastically bias at least one of the upper and lower contacts to make the upper and lower contacts distant from each other; an external conductor configured to surround the internal conductor; a plurality of gap members which is respectively inserted into opposite ends between the internal conductor and the external conductor to create a predetermined air gap between the internal conductor and the external conductor; and at least one external elastic member that is inserted into an external circumferential surface of the external conductor to elastically bias at least one of the semiconductor device and the tester to a direction that makes either the semiconductor device or the test distant from the external conductor.

Abstract: Disclosed is an inspection apparatus for a semiconductor device, which is to inspect an electric characteristic of an inspective object having a plurality of electric inspective contact points. The inspection apparatus includes a socket assembly which includes a plurality of probe pins retractable in a longitudinal direction, a probe pin supporter supporting the probe pins in parallel with each other, and a socket board including a plurality of fixed contact points a first end portion of the probe pins, and an inspective object carrier which includes an inspective object accommodating portion accommodating the inspective object so that the inspective contact points face toward a second end portion of the probe pins, and a floor member interposed between the inspective object and the probe pin supporter and including probe holes penetrated corresponding to the inspective contact points and passing the second end portion of the probe pin therethrough.

Abstract: Disclosed is a probe which stably transmits a test signal. The probe electrically connects a semiconductor device and a tester for testing the semiconductor device. The probe may include an upper plunger which is configured to be electrically connected to the semiconductor device; a lower plunger which is configured to be electrically connected to the tester; an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other; a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; and a barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member.

Abstract: A socket for testing a semiconductor chip includes a base cover, a conductive sheet, upper plungers, a housing, lower plungers and a support plate. The base cover has a coupling opening in the central portion thereof, and the conductive sheet is fitted into the coupling opening of the base cover and includes conductive parts and an insulation part. The upper plungers are seated onto upper ends of the conductive parts and come into contact with corresponding terminals of the semiconductor chip. The housing has insert holes at positions corresponding to the upper plungers and fastens the upper plungers to the corresponding conductive parts. The lower plungers are provided under lower ends of the conductive parts and come into contact with corresponding terminals of a PCB to electrically connect the conductive parts to the PCB.

Abstract: The present invention relates to a probe device for testing a semiconductor chip, and has the aim of providing a probe device for testing with higher test reliability through an improved structure that enables test current to flow safely, the probe device including a barrel open at the top and bottom thereof and a probe projection formed on a top end to contact a connection terminal of a semiconductor chip, an upper plunger having a lower portion housed in an upper portion of the barrel, and a lower plunger having an upper portion housed in a lower portion of the barrel, wherein a metal ball contained in cylindrical silicon to form a conductive silicon portion that exhibits conductivity and housed inside the band electrically connects the upper plunger and the lower plunger and resiliently supports the downward pressure transferred to the upper plunger during the testing of a semiconductor chip, such that the conductive silicon portion containing the metal ball for exhibiting conductivity and inserted in the

Abstract: A socket for testing a semiconductor chip includes a base cover, a conductive sheet, upper plungers, a housing, lower plungers and a support plate. The base cover has a coupling opening in the central portion thereof, and the conductive sheet is fitted into the coupling opening of the base cover and includes conductive parts and an insulation part. The upper plungers are seated onto upper ends of the conductive parts and come into contact with corresponding terminals of the semiconductor chip. The housing has insert holes at positions corresponding to the upper plungers and fastens the upper plungers to the corresponding conductive parts. The lower plungers are provided under lower ends of the conductive parts and come into contact with corresponding terminals of a PCB to electrically connect the conductive parts to the PCB.

Abstract: A contact probe and a socket for testing semiconductor chips are provided with a simple structure, so that they can be easily manufactured, and can reduce a signal path not only to improve test reliability but also remarkably reduce the dimensions of test equipment. The contact probe comprises: a nonconductive elastic plate having main through-holes corresponding to contact terminals of a test target; plungers coupled on upper sides of the main through-holes, each having a plunger head that is elastically supported by the elastic plate and a plunger body that extends downwards from the center of the plunger head; and contact pins coupled on lower sides of the main through-holes, each having a receiving hole contacting the plunger body of each plunger at a center thereof.

Abstract: Disclosed herein are a test probe and a method of manufacturing the test probe. The invention has a simple structure, thus affording ease of manufacture, and eliminates contact resistance during a test, thus enhancing the reliability of the test. The test probe includes a probe part which is provided on the upper portion of the probe and contacts a contact terminal of an object to be tested. A spring part, providing elastic force, extends integrally from the lower portion of the probe part, so that current flows from the object to the lower portion of the spring part. According to this invention, the spring part is integrally provided on the lower portion of the probe part, thus having a simple structure and affording ease of manufacture, and measuring current is transmitted directly from the probe part to the spring part, thus eliminating contact resistance and shortening the signal path, therefore enhancing the reliability of a test.

Abstract: A probe used for a high electric current. The prove comprises an outer pipe having a cylindrical configuration which is opened at upper and lower ends thereof; a plunger installed in an upper part of the outer pipe to be elastically extended out of and retracted into the outer pipe, and brought into contact with a contact terminal of a test object; a contact member installed in a lower part of the outer pipe and electrically connected with a contact terminal of a circuit board; and a plurality of contact wires installed at a region where the plunger and the contact member are engaged with each other, to electrically connect the plunger to the contact member, and each having one end which is bent outward.

Abstract: The present invention relates to an electrical connecting device, which enables to connect electrically an integrated circuit substrate to a printed circuit board in direct or to test an integrated circuit device in use of a printed circuit board.