Abstract: A multilayer electronic component according to an example embodiment may include: a body including dielectric layers and internal electrodes; and an external electrode including a connection portion, and a band portion extending from the connection portion, wherein the external electrode may include an electrode layer connected to the internal electrode and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (Ag) coating layer disposed between an electrode layer and a conductive resin layer of the band portion, and an average thickness of the silver (Ag) coating layer may be 2 ?m or more and 5 ?m or less.

Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a thickness direction; first and second side margin portions respectively disposed on the fifth and sixth surfaces of the body opposing each other in a width direction; a first glass layer and a second glass layer disposed on the first and second side margins and extending respectively to portion of a third surface of the body and a fourth surface of the body opposing the third surface in a length direction; and first and second external electrodes respectively disposed on the third and fourth surfaces. The internal electrode includes first internal and second electrodes having both ends thereof in the width direction covered respectively by the first and second glass layers on the third surface and fourth surfaces.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the third and fourth surfaces, wherein the external electrode includes a conductive resin layer including metal particles and a resin, and the metal particles include spherical particles and plate-shaped particles, wherein a cross-section of the external electrode in first and second directions include a lower region disposed below in the first direction and an upper region disposed above in the first direction, and the conductive resin layer may have a higher area ratio of spherical particles to the metal particles in the upper region than in the lower region.

Abstract: A multilayer electronic component includes a dielectric layer and first and second internal electrodes, a body including first and second surfaces opposing each other, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other, a glass layer disposed on the fifth and/or sixth surfaces, a first external electrode disposed on the glass layer, and second and third external electrodes disposed on the third and fourth surfaces, respectively, wherein the first internal electrode has a connection terminal extended to the fifth or sixth surface, and the glass layer is disposed to cover a portion of the connection terminal, and a length of the connection end is L1, and a length of a region of the connection terminal in contact with the first external electrode is L2, L1 and L2 may satisfy 0.74?L2/L1?0.90.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, internal electrodes, and a reinforcing pattern and an external electrode on the body. The internal electrodes are disposed alternately with the dielectric layer therebetween in the first direction. The reinforcing pattern is disposed on surfaces of a capacitance formation portion in the first direction. The reinforcing pattern contacts a surface of the body in a second direction. The reinforcing pattern includes four parts in a third direction from one end to the other end in the third direction. A length of the reinforcing pattern at a ¼ point in the second direction is greater than a length thereof at a ½ point in the second direction and a length thereof at a ¾ point in the second direction is greater than the length thereof at the ½ point in the second direction.

Abstract: In a multilayer electronic component according to an embodiment of the present disclosure, a step of the multilayer electronic component may be alleviated by adjusting the shape of the reinforcing pattern included in the reinforcing portion disposed on at least one of one surface and the other surface of the capacitance formation portion in the first direction, and the occurrence of bending cracks may be suppressed.

Abstract: A multilayer electronic component includes a body including a dielectric layer, and internal electrode layers disposed alternately in a first direction with the dielectric layer, and; first and second external electrodes disposed on the third and fourth surfaces, respectively, wherein internal electrode layer includes a main portion and an internal electrode extending from the main portion and connected to the external electrode through the lead portion, and a dummy electrode spaced apart from the internal electrode and connected to the external electrode, and a width of the lead portion may be smaller than a width of the main portion, at least a portion of the dummy electrode overlap the internal electrode in a length direction, and the dummy electrode may not overlap the internal electrode of another layer in a laminate direction.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes. The body includes first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, fifth and sixth surfaces opposing each other in a third direction. External electrodes are disposed on the third and fourth surfaces. At least one of the plurality of internal electrodes includes a main portion, a lead-out portion extending from the main portion in the second direction, having a first end portion contacting the external electrode, and an extension portion extending from the main portion opposite to the lead-out portion, and having a second end portion opposing the first end portion. When widths of the main portion, first end portion, and second end portion in the third direction are W1, W2, and W3, respectively, W2>W3>W1 is satisfied.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first to fourth internal electrode layers disposed alternately in a first direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces respectively, wherein the internal electrode layer includes an internal electrode and a dummy electrode spaced apart from each other with a spacing portion therebetween, and at least two of the spacing portions may include regions overlapping each other in the first direction and other regions do not overlapping each other.

Abstract: A multilayer electronic component includes a body containing a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body and connected to the internal electrode. The external electrode includes a conductive resin layer including metal particles, core-shell particles including a polymer core and a metal shell disposed on at least a portion of the polymer core, and a resin. The conductive resin layer includes a first region adjacent to the body and a second region adjacent to an outside of the conductive resin layer. In at least one cross section passing through the body, an area fraction occupied by the core-shell particles in the second region is greater than an area fraction occupied by the core-shell particles in the first region.

Abstract: A multilayer electronic component according to an example embodiment may include: a body including a plurality of dielectric layers, a first internal electrode, a second internal electrode, and a margin pattern; and an external electrode disposed on the body. The first and second internal electrodes may be alternately disposed in a first direction with the dielectric layer interposed therebetween, and the margin pattern may be disposed in a position different from the first and second internal electrodes in the first direction and may be disposed so as not to overlap the first internal electrode or the second internal electrode in the first direction.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed on the dielectric layer, an external electrode including a base electrode layer connected to the internal electrode, and an interface layer disposed between an end of the dielectric layer and the base electrode layer. The interface layer includes a first glass containing Ba, Zn, and Si. The base electrode layer includes a second glass containing Ba and Si. When an average molar ratio (Ba/Si) of Ba to Si contained in the first glass is M1 and an average molar ratio (Ba/Si) of Ba to Si contained in the second glass is M2, M1 and M2 satisfy M1/M2?1.5.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and an external electrode disposed on the body. The external electrode includes a first electrode layer in contact with the internal electrode and a second electrode layer disposed on the first electrode layer. The first electrode layer includes Cu, the second electrode layer includes Cu and SiC, and an area fraction of SiC in the second electrode layer is 5% or more and 20% or less. Moisture resistance reliability and adhesion strength of a multilayer electronic component may be improved.

Abstract: A multilayer electronic component according to an example embodiment may include: a body including dielectric layers and internal electrodes; and an external electrode including a connection portion, and a band portion extending from the connection portion, wherein the external electrode may include an electrode layer connected to the internal electrode and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (Ag) coating layer disposed between an electrode layer and a conductive resin layer of the band portion, and an average thickness of the silver (Ag) coating layer may be 2 ?m or more and 5 ?m or less.

Abstract: A multilayer electronic component includes: a body and an external electrode disposed on the body, wherein the external electrode includes a conductive resin layer containing a bisphenol A-based resin and a biphenyl-based resin with a specific mixing ratio (e.g., a ratio of a content of the biphenyl-based resin with respect to a total content is 10 wt % or more and 50 wt % or less). Such a resin mixing ratio between the bisphenol A-based resin and the biphenyl-based resin can lead to 0.337?2*C/A?0.367 or 0.048?B/A?0.14, with an aromatic ring peak intensity (A), a carbonyl peak intensity (B), and an alcohol peak intensity (C) in a Fourier transform infrared spectroscopy (FT-IR) analysis. The multilayer electronic component showing such peak intensity characteristics can suppress oxidation of a conductive resin layer while also securing excellent adhesive strength of the conductive resin layer.

Abstract: A power transmission system for driving a robot joint includes a driving part including a first driving unit and a second driving unit, a first force transmission part including a first sheath formed to have a predetermined length, flexibility, and a hollow shape and a first wire which is inserted into the first sheath and of which one end is fixed to a joint of a robot and the other end is connected to the first driving unit, and a second force transmission part including a second sheath formed to have a predetermined length, flexibility, and a hollow shape and a second wire which is inserted into the second sheath and of which one end is fixed to the joint of the robot and the other end is connected to the second driving unit.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.