Abstract: A wireless power transmission system includes a receiver position identifier unit configured to determine the positions of receiver apparatuses; a signal transmitter unit comprising antennas arrayed in a pre-designated pattern and configured to radiate wireless power signals by forming a beam in a pattern corresponding to signals supplied respectively to the antennas; and a beamforming unit configured to improve a wireless power transmission efficiency by temporarily setting a frequency vector, which is for designating frequencies of the signals supplied to the antennas, and a beamforming vector, which is for designating phases and gains of the signals, based on the positions of the receiver apparatuses and alternatingly iteratively estimating the other vector to enhance power transmission efficiency such that a multi-lobe beam pattern radiated simultaneously in the directions of the receiver apparatuses is formed in the antennas.

Abstract: The present exemplary embodiments provide a reinforcement learning based signal detection apparatus and method for vehicular MIMO communication which flexibly adjust the performance and the complexity by applying the reinforcement learning during the MIMO signal detecting process, improving a trade-off relationship between the performance and the complexity of the MIMO signal detection, and controlling the number of episodes of the reinforcement learning in accordance with the speed of the vehicle.

Abstract: A wireless power transmission system includes a receiver position identifier unit configured to determine the positions of receiver apparatuses; a signal transmitter unit comprising antennas arrayed in a pre-designated pattern and configured to radiate wireless power signals by forming a beam in a pattern corresponding to signals supplied respectively to the antennas; and a beamforming unit configured to improve a wireless power transmission efficiency by temporarily setting a frequency vector, which is for designating frequencies of the signals supplied to the antennas, and a beamforming vector, which is for designating phases and gains of the signals, based on the positions of the receiver apparatuses and alternatingly iteratively estimating the other vector to enhance power transmission efficiency such that a multi-lobe beam pattern radiated simultaneously in the directions of the receiver apparatuses is formed in the antennas.

Abstract: Provided is a printed circuit board (PCB). The PCB includes a board body that includes a first surface and a second surface opposite the first surface, a semiconductor chip mounting region that is disposed on the first surface of the board body, and includes a plurality of semiconductor chip mounting parts on which a semiconductor chip may be mounted, a through region that is disposed at a peripheral portion of the semiconductor chip mounting region, and includes a plurality of through holes passing through the board body, and an external terminal forming region that is disposed on the second surface of the board body, wherein a plurality of external terminal forming parts are disposed at the external terminal forming region in correspondence with the respective semiconductor chip mounting parts.

Abstract: Provided is a printed circuit board (PCB). The PCB includes a board body that includes a first surface and a second surface opposite the first surface, a semiconductor chip mounting region that is disposed on the first surface of the board body, and includes a plurality of semiconductor chip mounting parts on which a semiconductor chip may be mounted, a through region that is disposed at a peripheral portion of the semiconductor chip mounting region, and includes a plurality of through holes passing through the board body, and an external terminal forming region that is disposed on the second surface of the board body, wherein a plurality of external terminal forming parts are disposed at the external terminal forming region in correspondence with the respective semiconductor chip mounting parts.

Abstract: In an embodiment of the invention, a device for manufacturing a wafer-level package includes a wafer sawing unit, a sorting unit, a pickup unit, and a placing unit. The wafer sawing unit cuts a wafer into wafer-level packages. The sorting unit performs a sorting process on the wafer-level packages to judge whether each of the wafer-level packages is normal or not. The pickup unit picks up the normal wafer-level packages. The placing unit stores the normal wafer-level packages in a storage case. The sawing process, the sorting process, and the placing process for the wafer-level package can be automatically performed within one device, thus a processing time reduction, a processing accuracy increase, and manpower reduction are achieved compared with the case where the processes are performed manually.