Patents by Inventor Chaejoo LIM

Chaejoo LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10595407
    Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: March 17, 2020
    Assignee: LG Electronics Inc.
    Inventors: Jaehyuk Kim, Kyungcheol Paek, Chaejoo Lim
  • Publication number: 20190313529
    Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 10, 2019
    Applicant: LG Electronics Inc.
    Inventors: Jaehyuk KIM, Kyungcheol Paek, Chaejoo Lim
  • Patent number: 10342131
    Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: July 2, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Jaehyuk Kim, Kyungcheol Paek, Chaejoo Lim
  • Publication number: 20190131722
    Abstract: The present invention relates to a mobile terminal comprising: a terminal body; a main circuit board disposed in the body; a main conductive member spaced apart from the main circuit board and radiating electromagnetic waves at an end thereof; and a frequency varying unit disposed between the main conductive member and the main circuit board so as to vary the resonant frequency of the main conductive member, wherein the frequency varying unit comprises: a power supply unit connected to the main circuit board; and one or more sub-conductive members disposed between the main conductive member and the power supply unit; spaced apart from each other, and supplied with power by the power supply unit, and wherein the sub-conductive members and the main conductive member are a predetermined distance apart from each other.
    Type: Application
    Filed: January 20, 2017
    Publication date: May 2, 2019
    Applicant: LG ELECTRONICS INC.
    Inventors: Seungwoo RYU, Wonkyong CHOI, Taehoon KIM, Youngil KIM, Jaehyuk KIM, Chaejoo LIM, Joohee LEE, Wonwoo LEE
  • Patent number: 8943427
    Abstract: Disclosed is a user interface, and particularly, to a method for providing a user interface based on multiple displays and a mobile terminal using the same. The method for providing a user interface of a mobile terminal comprises controlling transparency of a first display unit, controlling the first display unit to display a first screen, controlling a second display unit to display a second screen, and controlling the second display unit to display one or more parts of the first screen.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: January 27, 2015
    Assignee: LG Electronics Inc.
    Inventors: Keunjae Heo, Chaejoo Lim
  • Publication number: 20120060089
    Abstract: Disclosed is a user interface, and particularly, to a method for providing a user interface based on multiple displays and a mobile terminal using the same. The method for providing a user interface of a mobile terminal comprises controlling transparency of a first display unit, controlling the first display unit to display a first screen, controlling a second display unit to display a second screen, and controlling the second display unit to display one or more parts of the first screen.
    Type: Application
    Filed: April 18, 2011
    Publication date: March 8, 2012
    Inventors: Keunjae HEO, Chaejoo LIM