Abstract: A molded power package includes a laser-activatable mold compound having laser-activated regions which are plated with an electrically conductive material to form metal pads and/or metal traces at a first side of the mold compound. A semiconductor power die with bond pads is embedded in the laser-activatable mold compound. A bond pad interconnect electrically connects the bond pads of the semiconductor power die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound. The semiconductor power die is mounted on a carrier section of a leadframe. A carrier interconnect section of the leadframe integral with the carrier section electrically connects the carrier section to the metal pads and/or metal traces at the first side of the laser-activatable mold compound. An upper surface of the carrier interconnect section is at a height that is elevated relative to an upper surface of the carrier section.

Abstract: A molded package includes: a semiconductor die; a substrate attached to a bottom side of the semiconductor die; an electrically conductive clip attached to a top side of the semiconductor die; and a mold compound encapsulating the semiconductor die. A top side of the electrically conductive clip faces away from the semiconductor die and has an exposed flat surface that overlays the semiconductor die and is not covered by the mold compound. A bottom side of the electrically conductive clip faces the semiconductor die and has a convex curved surface that is attached to the top side of the semiconductor die. Along a vertical cross-section of the electrically conductive clip from the exposed flat surface to the convex curved surface, the electrically conductive clip has a plano-convex shape delimited by the exposed flat surface and the convex curved surface. A method of producing the molded package is also described.

Abstract: A package is disclosed. In one example, the package includes an electronic component and an encapsulant encapsulating at least part of the electronic component. A first electrically conductive structure is arranged on one side of the electronic component, a second electrically conductive structure arranged on an opposing other side of the electronic component and being electrically coupled with the electronic component, and at least one sidewall recess at the encapsulant. The first electrically conductive structure and the second electrically conductive structure are configured to be at different electric potentials during operation of the package. The first electrically conductive structure and the second electrically conductive structure are exposed at opposing main surfaces of the encapsulant.

Abstract: An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.

Abstract: An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.

Abstract: An interconnect clip includes a die contact portion having planar upper and lower surfaces, a bridge portion adjoining the die contact portion and having planar upper and lower surfaces, a lead contact portion adjoining the bridge portion and having first and second planar lower surfaces that form an angled intersection with one another at a contact point, a first transition surface extending transversely from the lower surface of the bridge portion, and a second transition surface extending transversely from the lower surface of the bridge portion. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends from the first transition surface to the second transition surface along a second plane that is completely above the first plane. The first lower surface of the lead contact portion is tilted relative to the first plane.