Patents by Inventor Chai Chee Meng

Chai Chee Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DIE CARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150001696
    Abstract: Various embodiments provide a method of manufacturing a semiconductor die carrier structure. The method may include providing a die pad configured to carry a semiconductor die thereon; and bending at least one portion of the die pad, wherein the at least one bent portion extends across the die pad.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventor: Chai Chee Meng