Patents by Inventor Chai-Chi Lin

Chai-Chi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and method of manufacturing the same
    Patent number: 11811957
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: November 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuanhao Yu, Chung Ju Yu, Jui-Hsien Wang, Chai-Chi Lin, Hong Jie Chen
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220377161
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Chung Ju YU, Jui-Hsien WANG, Chai-Chi LIN, Hong Jie CHEN
  • SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
    Publication number: 20220373670
    Abstract: At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Chung Ju YU, Wei-Fan WU, Chai-Chi LIN, Hong Jie CHEN
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180166370
    Abstract: A semiconductor substrate includes an interconnection structure and a dielectric layer. The dielectric layer surrounds the interconnection structure and defines a first cavity. The first cavity is defined by a first sidewall, a second sidewall, and a first surface of the dielectric layer. The first sidewall is laterally displaced from the second sidewall.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 14, 2018
    Inventors: Chai-Chi LIN, Chih-Cheng LEE, Hsing Kuo TIEN, Chih-Yung YANG
  • Semiconductor device and method of manufacturing the same
    Patent number: 9997442
    Abstract: A semiconductor substrate includes an interconnection structure and a dielectric layer. The dielectric layer surrounds the interconnection structure and defines a first cavity. The first cavity is defined by a first sidewall, a second sidewall, and a first surface of the dielectric layer. The first sidewall is laterally displaced from the second sidewall.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: June 12, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chai-Chi Lin, Chih-Cheng Lee, Hsing Kuo Tien, Chih-Yung Yang