Patents by Inventor CHAI-CHING SUNG

CHAI-CHING SUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9754729
    Abstract: The instant disclosure relates to a solid electrolytic capacitor with improved metallic anode and a method for manufacturing the same. The solid electrolytic capacitor includes a substrate layer, a conductive polymer layer and an electrode layer. The substrate layer has a cathode portion and an anode portion having a smaller thickness than the cathode portion. The conductive polymer layer is formed to cover the cathode portion of the substrate layer. The electrode layer is formed to cover the conductive polymer layer. Therefore, the instant solid electrolytic capacitor can be applied to a packing process, and welding success yield rate can be improved.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: September 5, 2017
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventors: Chi-Hao Chiu, Ming-Tsung Chen, Chai-Ching Sung
  • Publication number: 20160240327
    Abstract: The present invention provides a capacitor unit with high-energy storage which includes an electrolyte, a positive electrode, and a negative electrode. The electrolyte includes an electrically conductive polymer composition. The positive and negative electrodes are arranged in the electrolyte. The positive electrode includes a substrate and a transition metal oxide layer formed on the substrate, resulting in the highest possible capacitance density.
    Type: Application
    Filed: June 29, 2015
    Publication date: August 18, 2016
    Inventors: CHING-FENG LIN, MING-TSUNG CHEN, CHI-HAO CHIU, CHAI-CHING SUNG
  • Publication number: 20160118195
    Abstract: The instant disclosure relates to a solid electrolytic capacitor with improved metallic anode and a method for manufacturing the same. The solid electrolytic capacitor includes a substrate layer, a conductive polymer layer and an electrode layer. The substrate layer has a cathode portion and an anode portion having a smaller thickness than the cathode portion. The conductive polymer layer is formed to cover the cathode portion of the substrate layer. The electrode layer is formed to cover the conductive polymer layer. Therefore, the instant solid electrolytic capacitor can be applied to a packing process, and welding success yield rate can be improved.
    Type: Application
    Filed: February 13, 2015
    Publication date: April 28, 2016
    Inventors: CHI-HAO CHIU, MING-TSUNG CHEN, CHAI-CHING SUNG