Patents by Inventor Chai Kok-Soon

Chai Kok-Soon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7648260
    Abstract: In one embodiment, an LED is constructed with its entire contact structure is stamped and inserted into the molded lamp as a single structure. A portion of the contact structure is imbedded in the molded lamp such that the bottom surface of the contacts do not extend below the base of the molded lamp. The base of the molded lamp is made wide enough to give support to the entire structure. Using this concept, any excess contract structure is cutoff and there is no need for bending of the contract structure to form the contact portions. In some embodiments, the cross-sectional area of the lamp base is extended to increase stability of the lamp when the lamp base is mounted on a flat surface.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: January 19, 2010
    Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Chai Kok-Soon, Wong Fu-Mauh
  • Publication number: 20080085622
    Abstract: In one embodiment, an LED is constructed with its entire contact structure is stamped and inserted into the molded lamp as a single structure. A portion of the contact structure is imbedded in the molded lamp such that the bottom surface of the contacts do not extend below the base of the molded lamp. The base of the molded lamp is made wide enough to give support to the entire structure. Using this concept, any excess contract structure is cutoff and there is no need for bending of the contract structure to form the contact portions. In some embodiments, the cross-sectional area of the lamp base is extended to increase stability of the lamp when the lamp base is mounted on a flat surface.
    Type: Application
    Filed: December 4, 2007
    Publication date: April 10, 2008
    Inventors: Chai Kok-Soon, Wong Fu-Mauh
  • Patent number: 7326062
    Abstract: In one embodiment, an LED is constructed with its entire contact structure stamped and inserted into the molded lamp as a single structure. A portion of the contact structure is imbedded in the molded lamp such that the bottom surface of the contacts do not extend below the base of the molded lamp. The base of the molded lamp is made wide enough to give support to the entire structure. Using this concept, any excess contact structure is cutoff and there is no need for bending of the contact structure to form the contact portions. In some embodiments, the cross-sectional area of the lamp base is extended to increase stability of the lamp when the lamp base is mounted on a flat surface.
    Type: Grant
    Filed: February 7, 2005
    Date of Patent: February 5, 2008
    Assignee: Avago Technologies ECBU IP Pte Ltd
    Inventors: Chai Kok-Soon, Wong Fu-Mauh
  • Publication number: 20060175615
    Abstract: In one embodiment, an LED is constructed with its entire contact structure is stamped and inserted into the molded lamp as a single structure. A portion of the contact structure is imbedded in the molded lamp such that the bottom surface of the contacts do not extend below the base of the molded lamp. The base of the molded lamp is made wide enough to give support to the entire structure. Using this concept, any excess contract structure is cutoff and there is no need for bending of the contract structure to form the contact portions. In some embodiments, the cross-sectional area of the lamp base is extended to increase stability of the lamp when the lamp base is mounted on a flat surface.
    Type: Application
    Filed: February 7, 2005
    Publication date: August 10, 2006
    Inventors: Chai Kok-Soon, Wong Fu-Mauh