Patents by Inventor Chai-Yun Jade Looi

Chai-Yun Jade Looi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing an optoelectronic semiconductor device
    Patent number: 11502228
    Abstract: A method of producing an optoelectronic semiconductor device includes providing a frame part including a plurality of openings, providing an auxiliary carrier, connecting the auxiliary carrier to the frame part such that the auxiliary carrier covers at least some of the openings at an underside of the frame part, placing conversion elements onto the auxiliary carrier in at least some of the openings, placing optoelectronic semiconductor chips onto the conversion elements in at least some of the openings, applying a housing onto the conversion elements and around the semiconductor chips in at least some of the openings, and removing the frame part and the auxiliary carrier wherein a bottom surface of at least some of the optoelectronic semiconductor chips remains free of the housing.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: November 15, 2022
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Seng-Teong Chang, Choon Keat Or, Lee-Ying Jacqueline Ng, Chai-Yun Jade Looi
  • METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR DEVICE
    Publication number: 20210119091
    Abstract: A method of producing an optoelectronic semiconductor device includes providing a frame part including a plurality of openings, providing an auxiliary carrier, connecting the auxiliary carrier to the frame part such that the auxiliary carrier covers at least some of the openings at an underside of the frame part, placing conversion elements onto the auxiliary carrier in at least some of the openings, placing optoelectronic semiconductor chips onto the conversion elements in at least some of the openings, applying a housing onto the conversion elements and around the semiconductor chips in at least some of the openings, and removing the frame part and the auxiliary carrier wherein a bottom surface of at least some of the optoelectronic semiconductor chips remains free of the housing.
    Type: Application
    Filed: August 4, 2017
    Publication date: April 22, 2021
    Inventors: Seng-Teong Chang, Choon Keat Or, Lee-Ying Jacqueline Ng, Chai-Yun Jade Looi