Patents by Inventor Chaitanya Arekar

Chaitanya Arekar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10412293
    Abstract: A transmitter optical sub-assembly includes a body and a receptacle assembled to a front side of the body, the receptacle including a nose body, a split sleeve enclosed by the nose body, a first body disposed behind the split sleeve, and a fiber stub either glued or shrink fit or pressed fit on to the first body, a rear end of the split sleeve being slip fitted on to the fiber stub; wherein the nose body is made from deep drawing or cold forging process and is attached on to a front surface of the body.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: September 10, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chaitanya Arekar, David Meadowcroft
  • Publication number: 20180348452
    Abstract: A transmitter optical sub-assembly includes a body and a receptacle assembled to a front side of the body, the receptacle including a nose body, a split sleeve enclosed by the nose body, a first body disposed behind the split sleeve, and a fiber stub either glued or shrink fit or pressed fit on to the first body, a rear end of the split sleeve being slip fitted on to the fiber stub; wherein the nose body is made from deep drawing or cold forging process and is attached on to a front surface of the body.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 6, 2018
    Inventors: CHAITANYA AREKAR, DAVID MEADOWCROFT
  • Patent number: 10079442
    Abstract: A mechanism (100) mounted on a printed circuit board for insertion of a transceiver, includes a frame structure; a pair of lead screws (30) mounted on and turnable with respect to the frame structure; a pair of cam units each coupled to a corresponding lead screw, the cam unit being actuatable by a turning movement of the lead screw; and a rail follower (50) disposed between the pair of cam units and confined to the frame structure, the rail follower having a receiving room for inserting the transceiver along a first direction, the rail follower being movable by the cam units actuated by the lead screws to move along a second direction perpendicular to the first direction.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: September 18, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Chaitanya Arekar
  • Publication number: 20180205164
    Abstract: A mechanism (100) mounted on a printed circuit board for insertion of a transceiver, includes a frame structure; a pair of lead screws (30) mounted on and turnable with respect to the frame structure; a pair of cam units each coupled to a corresponding lead screw, the cam unit being actuatable by a turning movement of the lead screw; and a rail follower (50) disposed between the pair of cam units and confined to the frame structure, the rail follower having a receiving room for inserting the transceiver along a first direction, the rail follower being movable by the cam units actuated by the lead screws to move along a second direction perpendicular to the first direction.
    Type: Application
    Filed: January 16, 2017
    Publication date: July 19, 2018
    Inventor: CHAITANYA AREKAR
  • Patent number: 9872419
    Abstract: A transceiver module includes a printed circuit board and a metal housing enclosing the printed circuit board and defining a front opening, the metal housing including a base portion and a cover portion, the base portion including two opposite side portions, the cover portion including two opposite fixing portions each engaged with a corresponding side portion; wherein each of the side portions defines a gap having an outside opening on an outside wall thereof, each of the fixing portions includes a top portion inwardly extending from a top end thereof, and the top portion is inserted in a corresponding gap.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: January 16, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chaitanya Arekar, David Meadowcroft, Sanjeev Gupta
  • Publication number: 20170205597
    Abstract: An optical communications module is equipped with a multi-piece, or split, OSA comprising an OSA receptacle that is separate from the OSA body and that remains spaced apart from the OSA body by wall of the metal module housing once the OSA has been installed in the metal module housing. The wall of the metal module housing has a hole formed in it that has a diameter that is generally equal to the size of the outer diameter of an optical stub of the OSA. The stub extends through the hole and has a proximal end that is secured to the OSA receptacle and a distal end that is secured to the OSA body. The corresponding EMI footprint is limited to being less than or equal to the diameter of the hole.
    Type: Application
    Filed: January 19, 2016
    Publication date: July 20, 2017
    Inventors: David J.K. Meadowcroft, Chaitanya Arekar
  • Publication number: 20160018608
    Abstract: An optical communications module includes a receptacle with a stop member. The receptacle has a keyway and a latchway. The keyway is configured to receive and guide a body of the connector plug in a direction along a keyway axis. The latchway is defined by a total flexure range of the flexible latch arm between a fully flexed state and a fully relaxed state. The latchway is configured to receive and guide the flexible latch arm through a range of movement having a directional component perpendicular to the keyway axis. The stop member extends from a wall of the receptacle into the latchway. The stop member is configured to restrain the flexible latch arm in a latched state between the fully flexed state and the fully relaxed state.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 21, 2016
    Inventors: Seng-Kum Chan, Chaitanya Arekar
  • Patent number: 9235013
    Abstract: An optical communications module includes a receptacle with a stop member. The receptacle has a keyway and a latchway. The keyway is configured to receive and guide a body of the connector plug in a direction along a keyway axis. The latchway is defined by a total flexure range of the flexible latch arm between a fully flexed state and a fully relaxed state. The latchway is configured to receive and guide the flexible latch arm through a range of movement having a directional component perpendicular to the keyway axis. The stop member extends from a wall of the receptacle into the latchway. The stop member is configured to restrain the flexible latch arm in a latched state between the fully flexed state and the fully relaxed state.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: January 12, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Seng-Kum Chan, Chaitanya Arekar
  • Patent number: 9106027
    Abstract: A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: August 11, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Seng-Kum Chan, Chaitanya Arekar, Hui Xu
  • Patent number: 9027903
    Abstract: Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: May 12, 2015
    Assignee: Autosplice, Inc.
    Inventors: Chaitanya Arekar, Leonid Foshansky, Kyle James Ovard, Jr., Robert Bogursky, George Marc Simmel
  • Publication number: 20140179129
    Abstract: A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Seng-Kum Chan, Chaitanya Arekar, Hui Xu
  • Publication number: 20120153043
    Abstract: Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.
    Type: Application
    Filed: May 31, 2011
    Publication date: June 21, 2012
    Inventors: Chaitanya Arekar, Leonid Foshansky, Kyle James Ovard, JR., Robert Bogursky, George Marc Simmel