Patents by Inventor Chak Hau Charles Pang

Chak Hau Charles Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11094852
    Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: August 17, 2021
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chak Hau Charles Pang, Yue Kwong Victor Lau, JuZuo Sheng, Christopher P. Hussell
  • Patent number: 10868220
    Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: December 15, 2020
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chak Hau Charles Pang, Yue Kwong Victor Lau, JuZuo Sheng, Christopher P. Hussell
  • Patent number: 10833054
    Abstract: Emitter panels and displays utilizing solid state packages and methods for fabricating the same are disclosed. One emitter panel comprises a raised barrier on a submount defining a plurality of cavities, each cavity having at least one LED in a pixel area. The panel is capable of receiving electrical signals for independently controlling the emission from the emitters. Solid state displays utilize the emitter panels mounted in relation to one another to generate a message or image. The panels comprise multiple pixels each having at least one light emitter, with each panel capable of receiving electrical signals for independently controlling the emission of at the pixels.
    Type: Grant
    Filed: February 8, 2014
    Date of Patent: November 10, 2020
    Inventors: Chi Keung Alex Chan, Zhenyu Zhong, Chak Hau Charles Pang, Yue Kwong Victor Lau, Erzhuang Liu
  • Patent number: 10679973
    Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: June 9, 2020
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chak Hau Charles Pang, Chi Keung Alex Chan, David Emerson, Yue Kwong Victor Lau, Zhenyu Zhong
  • Publication number: 20200176643
    Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities.
    Type: Application
    Filed: August 25, 2017
    Publication date: June 4, 2020
    Inventors: Chak Hau Charles Pang, Yue Kwong Victor Lau, JuZuo Sheng, Christopher P. Hussell
  • Patent number: 10615324
    Abstract: A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: April 7, 2020
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chi Keung Alex Chan, Yue Kwong Victor Lau, Chak Hau Charles Pang, Zhenyu Zhong
  • Publication number: 20200098957
    Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a cavity with emitters arranged in close proximity to approximate a point light source, with each of the packages emitting a color combination of light from the emitters. The LED packages are arranged with an encapsulant or lens over the cavity that shapes the LED package emission to a wide angle or pitch. One embodiment of an LED package according to the present invention comprises a cavity with a plurality LEDs. The LED package also comprises a lens over the cavity to shape the emission of the LEDs to a wider angle along an axis compared to emission of the LEDs without the lens. The LEDs are individually controllable, with the LED package emitting different color combinations of emission from the LEDs. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a cavity with a plurality of LEDs.
    Type: Application
    Filed: January 17, 2017
    Publication date: March 26, 2020
    Inventors: Chak Hau Charles PANG, Yue Kwong Victor LAU, JuZuo SHENG, Christopher P. HUSSELL
  • Publication number: 20180005999
    Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.
    Type: Application
    Filed: June 13, 2017
    Publication date: January 4, 2018
    Inventors: Chak Hau Charles Pang, Chi Keung Alex Chan, David Emerson, Yue Kwong Victor Lau, Zhenyu Zhong
  • Patent number: 9711489
    Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: July 18, 2017
    Assignee: CREE HUIZHOU SOLID STATE LIGHTING COMPANY LIMITED
    Inventors: Chak Hau Charles Pang, Chi Keung Alex Chan, David Emerson, Yue Kwong Victor Lau, Zhenyu Zhong
  • Publication number: 20140367712
    Abstract: A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 18, 2014
    Inventors: CHI KEUNG ALEX CHAN, YUE KWONG VICTOR LAU, CHAK HAU CHARLES PANG, ZHENYU ZHONG
  • Publication number: 20140353694
    Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 4, 2014
    Inventors: Chak Hau Charles Pang, Chi Keung Alex Chan, David Emerson, Yue Kwong Victor Lau, Zhanyu Zhong
  • Patent number: 8042978
    Abstract: A assembly includes at least a first and a second light emitting source for emission of light, and an air passage between the first and second light emitting sources to allow air flow therethrough for dissipation of heats generated by the light emitting sources.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: October 25, 2011
    Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
    Inventors: Ming Lu, Chak Hau Charles Pang, Kai Chiu Adam Wu, Lei Shirley Shi