Patents by Inventor Chak Hau Pang
Chak Hau Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230120969Abstract: LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.Type: ApplicationFiled: December 16, 2022Publication date: April 20, 2023Inventors: Charles Chak Hau Pang, Victor Yue Kwong Lau, Tiancai Su
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Patent number: 11545471Abstract: LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.Type: GrantFiled: July 7, 2017Date of Patent: January 3, 2023Assignee: CreeLED, Inc.Inventors: Charles Chak Hau Pang, Victor Yue Kwong Lau, Tiancai Su
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Publication number: 20220310567Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED packages are disclosed. Arrangements for LED packages are disclosed that provide improved reliability and improved emission characteristics in a variety of applications, including outdoor LED displays as well as general illumination. LED packages are disclosed with linear arrangements of LED chips and corresponding lenses to provide improved visibility and color mixing at higher viewing angles. LED packages are disclosed that include different types of lenses that are arranged within the same LED package depending on desired emission characteristics. Body structures for LED packages are disclosed that include arrangements for improved adhesion with encapsulant materials and optional potting materials to provide improved moisture barriers.Type: ApplicationFiled: May 22, 2019Publication date: September 29, 2022Inventors: Chak Hau Pang, JuZuo Sheng, Yue Kwong Lau, Zhenyu Zhong
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Publication number: 20200118983Abstract: LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.Type: ApplicationFiled: July 7, 2017Publication date: April 16, 2020Inventors: Charles Chak Hau PANG, Victor Yue Kwong LAU, Tiancai SU
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Patent number: 10431567Abstract: The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes.Type: GrantFiled: November 3, 2010Date of Patent: October 1, 2019Assignee: CREE, INC.Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Victor Yue Kwong Lau
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Patent number: 9831393Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.Type: GrantFiled: July 27, 2011Date of Patent: November 28, 2017Assignee: CREE HONG KONG LIMITEDInventors: Alex Chi Keung Chan, Charles Chak Hau Pang
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Patent number: 9685592Abstract: One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.Type: GrantFiled: June 6, 2011Date of Patent: June 20, 2017Assignee: Cree Huizhou Solid State Lighting Company LimitedInventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, Yue Kwong Lau, Jun Zhang, David Todd Emerson
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Patent number: 9634209Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.Type: GrantFiled: August 28, 2013Date of Patent: April 25, 2017Assignee: Cree, Inc.Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, David Todd Emerson
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Patent number: 9240395Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.Type: GrantFiled: November 30, 2010Date of Patent: January 19, 2016Assignee: CREE HUIZHOU OPTO LIMITEDInventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Li Fei Hong
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Patent number: 9054257Abstract: The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding the first plastic portion and exposing the mounting surface and the lower surface of the first plastic portion. In other embodiments, the first plastic portion includes at least one of a hole or a protrusion and the second portion includes corresponding structure filing the hole or surrounding the protrusion of the first plastic portion. The first plastic portion and the second portion have different optical properties.Type: GrantFiled: November 21, 2012Date of Patent: June 9, 2015Assignee: Cree Huizhou Solid State Lighting Company LimitedInventors: Chi Keung Chan, Chak Hau Pang, Fei Fei Ruan, Fei Hong Li
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Patent number: 8901583Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.Type: GrantFiled: April 12, 2010Date of Patent: December 2, 2014Assignee: Cree Huizhou Opto LimitedInventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Publication number: 20130341656Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.Type: ApplicationFiled: August 28, 2013Publication date: December 26, 2013Applicant: Cree, Inc.Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, David Todd Emerson
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Publication number: 20120132937Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.Type: ApplicationFiled: November 30, 2010Publication date: May 31, 2012Inventors: ALEX CHI KEUNG CHAN, Charles Chak Hau Pang, Li Fei Hong
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Publication number: 20120104426Abstract: The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes.Type: ApplicationFiled: November 3, 2010Publication date: May 3, 2012Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Victor Yue Kwong Lau
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Publication number: 20120104427Abstract: One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.Type: ApplicationFiled: June 6, 2011Publication date: May 3, 2012Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, Yue Kwong Lau, Jun Zhang, David Todd Emerson
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Publication number: 20120025227Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.Type: ApplicationFiled: July 27, 2011Publication date: February 2, 2012Inventors: ALEX CHI KEUNG CHAN, Charles Chak Hau Pang
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Publication number: 20110248293Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.Type: ApplicationFiled: April 12, 2010Publication date: October 13, 2011Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Patent number: D684545Type: GrantFiled: March 2, 2011Date of Patent: June 18, 2013Assignee: Cree Huizhou Solid State Lighting Company LimitedInventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, David Todd Emerson
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Patent number: D691100Type: GrantFiled: March 2, 2011Date of Patent: October 8, 2013Assignee: Cree Huizhou Solid State Lighting Company LimitedInventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, Yue Kwong Lau, Jun Zhang, David Todd Emerson
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Patent number: D908929Type: GrantFiled: December 4, 2017Date of Patent: January 26, 2021Assignee: CREE, INC.Inventors: Charles Chak Hau Pang, Victor Yue Kwong Lau, Tiancai Su