Abstract: The present invention relates methods for assisting a user having paralyzed muscles in walking. The methods focus on addressing foot drop and stimulating arm swing to aid in balance and mimic a “normal” person walk. The methods utilize a system capable of monitoring the gait cycle of the user and wireless transmitting signals to stimulation devices attached to the user's body.

Abstract: A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.