Abstract: A pick arm for a pick and place apparatus for electronic devices has a main body having a proximal end whereat the pick arm is mountable onto a pick arm support, and a distal end at which a collet is mounted for holding an electronic device. A first rigid body is located adjacent to the proximal end of the pick arm and a second rigid body is located adjacent to the distal end of the pick arm. The first and second flexures connect the first rigid body to the second rigid body. Moreover, the first flexure is spaced from the second flexure, and the first and second flexures have opposing faces that are arranged substantially parallel to each other. An actuator is operative to apply a biasing force onto the second rigid body so as to bend the first and second flexures relative to the first rigid body for biasing the collet of the pick arm to move.

Abstract: A pick arm for a pick and place apparatus for electronic devices has a main body having a proximal end whereat the pick arm is mountable onto a pick arm support, and a distal end at which a collet is mounted for holding an electronic device. A first rigid body is located adjacent to the proximal end of the pick arm and a second rigid body is located adjacent to the distal end of the pick arm. The first and second flexures connect the first rigid body to the second rigid body. Moreover, the first flexure is spaced from the second flexure, and the first and second flexures have opposing faces that are arranged substantially parallel to each other. An actuator is operative to apply a biasing force onto the second rigid body so as to bend the first and second flexures relative to the first rigid body for biasing the collet of the pick arm to move.

Abstract: A pick-and-place apparatus has a rotary turret and a plurality of pick arms arranged on the rotary turret for picking up and placing electronic devices during pick and place operations. A transmission stator and a transmission rotor are mounted on the rotary turret with an air gap between the transmission stator and the transmission rotor such that the transmission rotor is rotatable relative to the transmission stator. At least one motor for actuating at least one pick arm during the pick and place operations is operatively coupled to the transmission rotor. The transmission stator and the transmission rotor are configured to transmit data signals wirelessly across the air gap for driving the at least one motor to actuate the at least one pick arm.

Abstract: A pick-and-place apparatus has a rotary turret and a plurality of pick arms arranged on the rotary turret for picking up and placing electronic devices during pick and place operations. A transmission stator and a transmission rotor are mounted on the rotary turret with an air gap between the transmission stator and the transmission rotor such that the transmission rotor is rotatable relative to the transmission stator. At least one motor for actuating at least one pick arm during the pick and place operations is operatively coupled to the transmission rotor. The transmission stator and the transmission rotor are configured to transmit data signals wirelessly across the air gap for driving the at least one motor to actuate the at least one pick arm.

Abstract: A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.

Abstract: A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.

Abstract: An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.

Abstract: A transfer apparatus has a conveying track for electronic devices in a row, two vacuum passages to create vacuum forces to hold electronic devices against the conveying track at first and second positions respectively preventing overlapping of electronic devices; and sensors arranged with respect to the conveying track, the first sensor detects presence or absence of the leading electronic device at the first position for removal of the leading electronic device from the conveying track, and the second sensor detects presence or absence of the leading electronic device at a sensor position between the first and second positions as the leading electronic device is conveyed along the conveying track from the second to the first vacuum passage.

Abstract: A transfer apparatus has a conveying track for electronic devices in a row, two vacuum passages to create vacuum forces to hold electronic devices against the conveying track at first and second positions respectively preventing overlapping of electronic devices; and sensors arranged with respect to the conveying track, the first sensor detects presence or absence of the leading electronic device at the first position for removal of the leading electronic device from the conveying track, and the second sensor detects presence or absence of the leading electronic device at a sensor position between the first and second positions as the leading electronic device is conveyed along the conveying track from the second to the first vacuum passage.

Abstract: A device sorting apparatus 100 is disclosed herein. In a described embodiment, the device sorting apparatus 100 comprises a plurality of bin connectors 120 for coupling to respective bins for storing sorted devices and a rotary distribution module 102 for receiving a device 200 to be sorted and for discharging the device 200 selectively into one of the bin connectors 120 to enable the device 200 to be unloaded to the respective bin. The device sorting apparatus 100 further comprises a sensor 110 coupled to the rotary distribution module 102 for detecting the discharge of the device 200, and which is rotatable together with the rotary distribution module 102; and a rotary transformer 400 for powering the sensor 110.

Abstract: An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.

Abstract: A wafer processing apparatus used for the testing of electronic devices comprises first and second clampers movably mounted on a shaft, each clamper being configured for holding a wafer carrier on which a wafer is mounted. Clamping fingers on each of the first and second clampers are operative to clamp onto the wafer carrier to hold the wafer carriers, and the clampers are operative to move the wafer carriers reciprocally between a loading position and a wafer processing location for processing the wafers.

Abstract: A sorting system is provided for electronic components such as LED devices which includes a testing station for testing and determining a characteristic of each electronic component. A first tray has a plurality of receptacles for receiving tested electronic components and a second tray has more receptacles than the first tray for receiving tested electronic components. Electronic components comprising tested characteristics that occur with greater frequency are loaded into the receptacles of the first tray and electronic components comprising tested characteristics that occur with lower frequency are loaded into the receptacles of the second tray.

Abstract: A device handler for testing and sorting electronic devices has a testing station operative to test the electronic devices and to classify them according to different binning characteristics. A buffer assembly receives electronic devices which have been classified at the testing station, and the buffer assembly further comprises a first loading region having a plurality of receptacles and a second loading region having a plurality of receptacles. An output station is operative to unload electronic devices according to their different binning characteristics from either one of the first or second loading region of the buffer assembly for storage while electronic devices are being loaded onto the other loading region.

Abstract: A sorting system is provided for electronic components such as LED devices which includes a testing station for testing and determining a characteristic of each electronic component. A first tray has a plurality of receptacles for receiving tested electronic components and a second tray has more receptacles than the first tray for receiving tested electronic components. Electronic components comprising tested characteristics that occur with greater frequency are loaded into the receptacles of the first tray and electronic components comprising tested characteristics that occur with lower frequency are loaded into the receptacles of the second tray.

Abstract: The invention provides a unitary spring contact probe comprising a resilient spring section, a plunger section extending from a distal end of the resilient spring section for contacting a semiconductor device under test and a stopper projecting from the plunger section substantially transversely to an axial direction of the plunger section. There is also provided an apparatus for testing a semiconductor comprising a plurality of said unitary spring contact probes, one or more insulative guiding holders for mounting the spring contact probes, and a retainer mechanism coupled to the stoppers of the spring contact probes for securing the spring contact probes to the insulative guiding holders.