Abstract: A foldable computing device is described. The foldable computing device can include a power switch, a display screen unit including a first magnet, a base unit and an actuator. The base unit can include an assembly with a second magnet and a third magnet. The assembly can be at a first position that causes the first magnet of the display screen unit to attract to the second magnet of the assembly of the base unit to lock the display screen unit. The actuator can receive an electrical pulse when the power switch is selected to power on the foldable computing device and provide a motion to move the assembly to a second position, to cause the first magnet of the display screen unit to be moved away from the second magnet and repulse the third magnet of the assembly in the base unit to unlock the display screen unit.

Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate; a micro-arc oxidation layer or a non-transparent passivation treatment layer on a surface of the metal cover substrate; an outmold decoration layer on the micro-arc oxidation layer or the non-transparent passivation treatment layer, a chamfered edge including a chamfer at an edge of the metal cover substrate, wherein the chamfer cuts through the micro-arc oxidation layer or the non-transparent passivation treatment layer and the outmold decoration layer to expose the metal cover substrate at the chamfered edge; a transparent passivation layer on the chamfered edge where the metal cover substrate is exposed; and a protective coating on the transparent passivation layer.

Abstract: A magnesium alloy layered composite for an electronic device can include a magnesium alloy substrate, a passivation layer positioned on the magnesium alloy substrate, and a sol-gel layer positioned on the passivation layer. The passivation layer can include a molybdate, a vanadate, a phosphate, a chromate, a stannate, or a manganese salt. The sol-gel layer can include a silicate, a silane, a siloxane, or a metal C1-C5 alkoxide.

Abstract: The present subject matter relates to treating anodized alloy substrates. An anodized alloy substrate is immersed in a titanium salt solution to deposit titanium ions in a surface of the anodized alloy substrate. The immersion results in the formation of a processed substrate. The processed substrate is anodized to form a finished substrate. The anodization oxidizes the titanium ions to titanium dioxide particles.

Abstract: The present subject matter relates to treating alloy substrates having oxidized layers. An anodized alloy substrate is contacted with an alkaline mixture including titanium to form a processed substrate. The anodized alloy substrate includes an oxidized layer on its surface. The processed substrate is baked to form a finished substrate. The finished substrate includes titanium dioxide particles in the oxidized layer.

Abstract: One example provides a method of manufacturing. The method comprises oxidizing, using plasma, a first surface of a substrate comprising a metal-material. The method further comprises cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface. The method further comprises disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.

Abstract: Various examples described herein provide for a substrate, or a method for preparing a substrate, including a first electroplated layer disposed over a metal substrate, a second electroplated layer disposed under the metal substrate, and an electrophoretic deposition layer disposed over the first electroplated layer.

Abstract: Various examples described herein provide for a substrate, or a method for preparing a substrate, including an aluminum layer and an anodized layer over a substrate. For instance, the substrate may comprise a substrate, a continuous aluminum layer formed over the substrate, and an anodized layer formed over the continuous aluminum layer.

Abstract: One example provides a method of manufacturing. The method comprises oxidizing, using plasma, a first surface of a substrate comprising a metal-material. The method further comprises cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface. The method further comprises disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.

Abstract: According to one example, preparing a substrate for an electronic device can include forming a deposition layer on a magnesium alloy substrate, anodizing the magnesium alloy substrate, and forming an electrophoretic deposition layer on the anodized magnesium alloy substrate.

Abstract: A multi-layered metal includes a first layer, and a second layer on the first layer. The second layer is bonded to the first layer, by applying at least one of heat and pressure to an assembly including the first layer and the sheet to cause inter-metal diffusion between the first layer and the second layer.

Abstract: A roller includes an outer cylindrical portion and an inner cylindrical portion arranged concentrically with the outer cylindrical portion. A plurality of connection spokes are provided for connecting the outer cylindrical portion and the inner cylindrical portion to each other, wherein each of the connection spokes are connected along a non-linear connection path with respect to an axis extending between the outer cylindrical portion and the inner cylindrical portion of the roller to provide a tunable spring constant in the roller.