Patents by Inventor Chalermsak Sumithpibul

Chalermsak Sumithpibul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for plating a semiconductor package
    Patent number: 7922877
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: April 12, 2011
    Assignee: Utac Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
  • Method and apparatus for plating a semiconductor package
    Publication number: 20100140081
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 10, 2010
    Applicant: UTAC Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
  • Method and apparatus for plating a semiconductor package
    Patent number: 7718522
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: May 18, 2010
    Assignee: UTAC Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
  • METHOD AND APPARATUS FOR PLATING A SEMICONDUCTOR PACKAGE
    Publication number: 20080299756
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 4, 2008
    Applicant: UTAC Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa