Patents by Inventor Chamith Sudesh Rajapakse

Chamith Sudesh Rajapakse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11872764
    Abstract: Methods, systems, and computer readable media for 3D printing from images, e.g., medical images or images obtained using any appropriate volumetric imaging technology. In some examples, a method includes receiving, from a medical imaging device, a multi-dimensional image of a structure. The method includes, for each two dimensional (2D) slice of the multi-dimensional image, converting, row-by-row for each row of the 2D slice, voxels of the 2D slice into 3D printing instructions for the 2D slice. The method includes 3D printing, by controlling a 3D printing extruder, a physical model based on the structure by 3D printing, slice by slice, each 2D slice using the 3D printing instructions.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: January 16, 2024
    Assignee: THE TRUSTEES OF THE UNIVERISTY OF PENNSYLVANIA
    Inventor: Chamith Sudesh Rajapakse
  • Publication number: 20220237779
    Abstract: In some examples, a method includes receiving a medical image of at least a portion of a spine in a patient. The method includes supplying the medical image to a neural network trained using training spine images and, for each training spine image, one or more spine measurement annotations. The method includes detecting, using the neural network, five or more vertebral landmarks for each of a plurality of vertebral bodies depicted in the medical image. The method includes outputting, for at least a first vertebral body, one or more deformity measurements based on the vertebral landmarks for the first vertebral body.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 28, 2022
    Inventors: Chamith Sudesh Rajapakse, Abhinav Suri
  • Patent number: 11202602
    Abstract: Methods, systems, and computer readable media for non-invasively predicting patient-specific mechanical competence at an anatomical site. In some examples, a method includes receiving images from the anatomical site of a patient; using computational analysis of the images to simulate mechanical loading at the anatomical site; and generating, based on the analysis, an indication of stiffness, strength, resilience or toughness under the mechanical loading conditions.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: December 21, 2021
    Assignees: THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA, NEW YORK UNIVERSITY
    Inventors: Chamith Sudesh Rajapakse, Gregory Chang
  • Publication number: 20210170689
    Abstract: Methods, systems, and computer readable media for for 3D printing from images, e.g., medical images or images obtained using any appropriate volumetric imaging technology. In some examples, a method includes receiving, from a medical imaging device, a multi-dimensional image of a structure. The method includes, for each two dimensional (2D) slice of the multi-dimensional image, converting, row-by-row for each row of the 2D slice, voxels of the 2D slice into 3D printing instructions for the 2D slice. The method includes 3D printing, by controlling a 3D printing extruder, a physical model based on the structure by 3D printing, slice by slice, each 2D slice using the 3D printing instructions.
    Type: Application
    Filed: December 5, 2018
    Publication date: June 10, 2021
    Inventor: Chamith Sudesh Rajapakse
  • Publication number: 20190183410
    Abstract: Methods, systems, and computer readable media for non-invasively predicting patient-specific mechanical competence at an anatomical site. In some examples, a method includes receiving images from the anatomical site of a patient; using computational analysis of the images to simulate mechanical loading at the anatomical site; and generating, based on the analysis, an indication of stiffness, strength, resilience or toughness under the mechanical loading conditions.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 20, 2019
    Inventors: Chamith Sudesh Rajapakse, Gregory Chang