Abstract: Disclosed herein are an insulation member, a method of manufacturing the insulation member, and a method of manufacturing a cylindrical battery including the insulation member, and more particularly an insulation member including an insulation plate substrate configured as a reticular structure formed by glass fiber strands and a binder applied to the insulation plate substrate, a method of manufacturing the insulation member, and a method of manufacturing a cylindrical battery including the insulation member.

Abstract: Disclosed herein is a cylindrical battery using an anti-corrosive gasket including a volatile corrosion inhibitor and a base resin. Consequently, the cylindrical battery achieves remarkable anti-corrosion effects under high-temperature and high-humidity conditions. This effect cannot be achieved by various conventional anti-corrosion technologies, such as those of a conventional anti-corrosive washer and a conventional anti-corrosive tube, in the field of cylindrical batteries.

Abstract: A cylindrical battery cell includes a jelly-roll type electrode assembly, configured to have a structure in which a positive electrode and a negative electrode are wound in a state in which a separator is disposed between the positive electrode and the negative electrode; a cylindrical battery case having no beading part; a cap assembly located at the open upper end of the cylindrical battery case, the cap assembly including a safety vent configured to rupture in order to exhaust gas when pressure in the battery case increases; a gasket mounted so as to surround the outer circumference of the safety vent in order to maintain insulation between the cap assembly and the cylindrical battery case; and a washer for fixing the cap assembly to the cylindrical battery case, the washer coupled to an upper surface of an outer circumferential portion of the open upper end of the cylindrical battery case.

Abstract: Disclosed herein is a pouch-shaped secondary battery including a micro-perforated electrode lead having adhesive properties that is capable of enabling a short circuit to occur in the pouch-shaped secondary battery using the adhesive properties of the micro-perforated electrode lead with respect to a pouch-shaped battery case in order to secure the safety of the pouch-shaped secondary battery when the pouch-shaped secondary battery swells due to gas generated in the pouch-shaped secondary battery while the pouch-shaped secondary battery is in an abnormal state or when the pouch-shaped secondary battery is overcharged. Current is prevented from flowing in the pouch-shaped secondary battery when the pouch-shaped secondary battery is overcharged or when the pouch-shaped secondary battery is in an abnormal state.

Abstract: A reactive cyclodextrin derivative or a reactive glucose derivative is used as a template derivative for forming an ultra-low dielectric layer. A layer is formed of the reactive cyclodextrin derivative or the reactive glucose derivative capped with Si—H and then cured in an atmosphere of hydrogen peroxide to form the ultra-low dielectric layer.

Abstract: A reactive cyclodextrin derivative or a reactive glucose derivative is used as a template derivative for forming an ultra-low dielectric layer. A layer is formed of the reactive cyclodextrin derivative or the reactive glucose derivative capped with Si—H and then cured in an atmosphere of hydrogen peroxide to form the ultra-low dielectric layer.

Abstract: A reactive cyclodextrin derivative or a reactive glucose derivative is used as a template derivative for forming an ultra-low dielectric layer. A layer is formed of the reactive cyclodextrin derivative or the reactive glucose derivative capped with Si—H and then cured in an atmosphere of hydrogen peroxide to form the ultra-low dielectric layer.

Abstract: A reactive cyclodextrin derivative or a reactive glucose derivative is used as a template derivative for forming an ultra-low dielectric layer. A layer is formed of the reactive cyclodextrin derivative or the reactive glucose derivative capped with Si—H and then cured in an atmosphere of hydrogen peroxide to form the ultra-low dielectric layer.

Abstract: A reactive cyclodextrin derivative or a reactive glucose derivative is used as a template derivative for forming an ultra-low dielectric layer. A layer is formed of the reactive cyclodextrin derivative or the reactive glucose derivative capped with Si—H and then cured in an atmosphere of hydrogen peroxide to form the ultra-low dielectric layer.

Abstract: A process for manufacturing a semiconductor device using a spacer as an etch mask for forming a fine pattern is described. The process includes forming a hard mask layer over a target layer that is desired to be etched. A sacrificial layer pattern is subsequently formed over the hard mask layer. Spacers are formed on the sidewalls of the sacrificial layer pattern. The protective layer is formed on the hard mask layer portions between the sacrificial patterns formed with the spacer. The sacrificial layer pattern and the protective layer are then later removed, respectively. The hard mask layer is etched using the spacer as an etching mask. After etching, the spacer is removed. Finally, the target layer is etched using the etched hard mask as an etching mask.

Abstract: A semiconductor device is manufactured by forming a low dielectric constant layer on a semiconductor substrate which is formed with metal lines; implementing primary ultraviolet treatment of the low dielectric constant layer; forming a capping layer on the low dielectric constant layer having undergone the primary ultraviolet treatment; and implementing secondary ultraviolet treatment of the low dielectric constant layer including the capping layer.

Abstract: The semiconductor device having an air gap includes an insulation layer formed on a semiconductor substrate and having a metal line forming region. A metal line is formed to fill the metal line forming region of the insulation layer. An air gap is formed between the insulation layer and the metal line.

Abstract: A process for manufacturing a semiconductor device using a spacer as an etch mask for forming a fine pattern is described. The process includes forming a hard mask layer over a target layer that is desired to be etched. A sacrificial layer pattern is subsequently formed over the hard mask layer. Spacers are formed on the sidewalls of the sacrificial layer pattern. The protective layer is formed on the hard mask layer portions between the sacrificial patterns formed with the spacer. The sacrificial layer pattern and the protective layer are then later removed, respectively. The hard mask layer is etched using the spacer as an etching mask. After etching, the spacer is removed. Finally, the target layer is etched using the etched hard mask as an etching mask.

Abstract: A semiconductor device is manufactured by forming a low dielectric constant layer on a semiconductor substrate which is formed with metal lines; implementing primary ultraviolet treatment of the low dielectric constant layer; forming a capping layer on the low dielectric constant layer having undergone the primary ultraviolet treatment; and implementing secondary ultraviolet treatment of the low dielectric constant layer including the capping layer.

Abstract: In manufacturing a semiconductor device, a metal film is formed on a semiconductor substrate, and a high-temperature amorphous carbon film pattern for defining a wiring forming area is formed on the metal film. The metal film is etched by using the high-temperature amorphous carbon film pattern as an etching barrier to form a metal wiring. A low-temperature amorphous carbon film as an IMD is formed on the resultant structure so as to cover the metal wiring including the high-temperature amorphous carbon film pattern. The low-temperature amorphous carbon film and the high-temperature amorphous carbon film pattern are etched to form a contact hole, which has greater width in an upper portion than in a lower portion thereof. Finally, a plug metal film is formed on the low-temperature amorphous carbon film to fill the contact hole.

Abstract: A reactive cyclodextrin derivative or a reactive glucose derivative is used as a template derivative for forming an ultra-low dielectric layer. A layer is formed of the reactive cyclodextrin derivative or the reactive glucose derivative capped with Si—H and then cured in an atmosphere of hydrogen peroxide to form the ultra-low dielectric layer.

Abstract: A method for forming the storage node of a capacitor which simplifies its process, and improves the electrical characteristics of semiconductor products by forming the storage node of a capacitor with no stepped portion between cell regions and peripheral circuit regions necessary for memory storage of semiconductor products of the next generation to which a fine line width is applied, and, at the same time, forming a guard ring for dividing the cell regions and the peripheral circuit regions.

Abstract: A method for forming the storage node of a capacitor which simplifies its process, and improves the electrical characteristics of semiconductor products by forming the storage node of a capacitor with no stepped portion between cell regions and peripheral circuit regions necessary for memory storage of semiconductor products of the next generation to which a fine line width is applied, and, at the same time, forming a guard ring for dividing the cell regions and the peripheral circuit regions.