Patents by Inventor Chan-Chung CHENG

Chan-Chung CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION
    Publication number: 20240096834
    Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.
    Type: Application
    Filed: March 27, 2023
    Publication date: March 21, 2024
    Inventors: Shih Hsuan HSU, Chan-Chung CHENG, Chun-Chen LIU, Cheng-Hung CHEN, Peng-Ren CHEN, Wen-Hao CHENG, Jong-l MOU