Patents by Inventor Chan Eon Park

Chan Eon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120153264
    Abstract: A method of forming an organic thin film may include providing a substrate; providing an organic solution including an organic solute and a solvent having a boiling point of about 85° C. or less; dipping the substrate into the organic solution; removing the substrate from the organic solution; and/or precipitating the organic solute on the substrate to provide an organic thin film, wherein the removing the substrate from the organic solution is performed at a speed of about 10 to about 300 ?m/s from one end of the substrate to the other end of the substrate. Accordingly, an organic thin film having advantageous characteristics and a wide area may be obtained.
    Type: Application
    Filed: May 3, 2011
    Publication date: June 21, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Jin Park, Kyu Hyun Im, Chan-Eon Park, Jong Min Kim, Jin Eun Kim
  • Patent number: 6849926
    Abstract: A composite containing nano magnetic particles is provided. The composite includes nano magnetic particles in a dielectric matrix. The matrix is made of an inorganic material such as silica, alumina, or hydrosilsesquioxane, or an organic material such as polyimide, polymethyl methacrylate, or methyl silsesquioxane. The nano magnetic particles consist of Fe2O3, chromium oxide, europium oxide, NiZn-ferrite, MnZn-ferrite, yttrium-iron garnet, or indium In.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: February 1, 2005
    Assignee: Pohang University of Science and Technology Foundation
    Inventors: Chan Eon Park, Jin Ho Kang
  • Patent number: 6531564
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: March 11, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song
  • Publication number: 20020161151
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1
    Type: Application
    Filed: June 28, 2002
    Publication date: October 31, 2002
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song
  • Patent number: 6468664
    Abstract: The present invention relates to a poly(imide-siloxane) compound useful as passivation layer for packaging tapeless LOC, which is produced by reacting in a polar solvent a diaminosiloxane compound of the formula(1) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently an aromatic group, aliphatic group or halogenated hydrocarbon, hydroxy, or ether group, and m and n are integers such that m+n is an integer of 0˜1000; and a diamine compound of the formula(2) H2N—R—NH2   (2) wherein R is at least one selected from the below groups: with an aromatic tetracarboxylic dianhydride of the formula (3) wherein A is at least one selected from the below groups: wherein the number of moles of the compound (3) is the same as the total number of moles of compounds (1) and (2).
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: October 22, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan Eon Park, Jin Ho Kang, Sang Min Song, Young Tak Ahn, Jae Geun Park, Myung Sup Jung
  • Patent number: 6455654
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.
    Type: Grant
    Filed: January 18, 2001
    Date of Patent: September 24, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song
  • Publication number: 20020035222
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1
    Type: Application
    Filed: January 18, 2001
    Publication date: March 21, 2002
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song
  • Publication number: 20020027262
    Abstract: A composite containing nano magnetic particles is provided. The composite includes nano magnetic particles in a dielectric matrix. The matrix is made of an inorganic material such as silica, alumina or hydrosilsesquioxane, or an organic material such as polyimide, polymethyl methacrylate (PMMA) or methyl silsesquioxane. The nano magnetic particles consist of (y-Fe2O3), chromium oxide (CrO2), europium oxide (EuO), NiZn-ferrite, MnZn-ferrite, Yittrium-iron garnet or indium (In).
    Type: Application
    Filed: April 23, 2001
    Publication date: March 7, 2002
    Inventors: Chan Eon Park, Jin-ho Kang
  • Patent number: 5543493
    Abstract: A method for treating a polyimide surface which includes the steps of amine-treating the polyimide surface and drying the thusly amine-treated polyimide surface. The amine-treating step is preferably carried out by immersing the polyimide in an amine solution which includes an amine and a solvent. The amine is preferably an aliphatic, aromatic, or siloxane amine. The drying step is preferably carried out a temperature of about 50.degree.-200.degree. C. The polyimide is preferably a polyimide having at least one imide functional group in its main chain, and is most preferably a polycondensate of at least one dianhydride and at least one diamine.
    Type: Grant
    Filed: July 26, 1994
    Date of Patent: August 6, 1996
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan-eon Park, Hwang-kyu Yun, Sung-min Sim, Wan-gyun Choi