Patents by Inventor Chan Gi PARK

Chan Gi PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411832
    Abstract: Disclosed is a portable communication device including a housing; a first PCB; a wireless communication circuitry disposed on the first PCB; and a second PCB having a plurality of layers including a first PCB portion; a second PCB portion extended from the first PCB portion and more flexible than the first PCB portion; a third PCB portion extended from the second PCB portion and less flexible than the second PCB portion; a fourth PCB portion extended from the third PCB portion and more flexible than the third PCB portion; and a plurality of lines formed at a same layer of the plurality of layers as extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line, and a first signal line between the first and second ground lines.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Inventors: Han-Min CHO, Chan-Gi PARK, Yeon-Sang YUN, Tae-Wook HAM, Hei-Seong KWAK, Byoung-Il SON, Sung-Chul PARK
  • Patent number: 11749880
    Abstract: Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: September 5, 2023
    Inventors: Han-Min Cho, Chan-Gi Park, Yeon-Sang Yun, Tae-Wook Ham, Hei-Seong Kwak, Byoung-Il Son, Sung-Chul Park
  • Publication number: 20230134315
    Abstract: Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.
    Type: Application
    Filed: December 28, 2022
    Publication date: May 4, 2023
    Inventors: Han-Min CHO, Chan-Gi PARK, Yeon-Sang YUN, Tae-Wook HAM, Hei-Seong KWAK, Byoung-II SON, Sung-Chul PARK
  • Patent number: 11569565
    Abstract: Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: January 31, 2023
    Inventors: Han-Min Cho, Chan-Gi Park, Yeon-Sang Yun, Tae-Wook Ham, Hei-Seong Kwak, Byoung-Il Son, Sung-Chul Park
  • Publication number: 20210226320
    Abstract: Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.
    Type: Application
    Filed: April 8, 2021
    Publication date: July 22, 2021
    Inventors: Han-Min CHO, Chan-Gi PARK, Yeon-Sang YUN, Tae-Wook HAM, Hei-Seong KWAK, Byoung-II SON, Sung-Chul PARK
  • Patent number: 10999921
    Abstract: A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: May 4, 2021
    Inventors: Chan-Gi Park, Yikyu Min, Han Min Cho, Yeonsang Yun, Tae-Wook Ham
  • Patent number: 10978789
    Abstract: Disclosed is an electronic device including a housing, a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers, a first electrical component formed as at least a part of or in the housing, a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated, and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 13, 2021
    Inventors: Han-Min Cho, Chan-Gi Park, Yeon-Sang Yun, Tae-Wook Ham, Hei-Seong Kwak, Byoung-Il Son, Sung-Chul Park
  • Publication number: 20200358166
    Abstract: Disclosed is an electronic device including a housing, a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers, a first electrical component formed as at least a part of or in the housing, a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated, and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Inventors: Han-Min CHO, Chan-Gi PARK, Yeon-Sang YUN, Tae-Wook HAM, Hei-Seong KWAK, Byoung-Il SON, Sung-Chul PARK
  • Patent number: 10727568
    Abstract: An electronic device including a housing; a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers; a first electrical component formed as at least a part of or in the housing; a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated; and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: July 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Min Cho, Chan-Gi Park, Yeon-Sang Yun, Tae-Wook Ham, Hei-Seong Kwak, Byoung-Il Son, Sung-Chul Park
  • Publication number: 20180359845
    Abstract: A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 13, 2018
    Inventors: Chan-Gi PARK, Yikyu MIN, Han Min CHO, Yeonsang YUN, Tae-Wook HAM
  • Patent number: 9859661
    Abstract: A connector mounted on a printed circuit board (PCB) is provided. The connector includes a mid-plate electrically connected to a ground terminal of the PCB and including a metallic material, a plurality of upper terminals situated on the mid-plate, a plurality of lower terminals situated under the mid-plate, a first insulation member situated on the mid-plate while supporting the upper terminals, a second insulation member situated under the mid-plate while supporting the lower terminals, and a pad electrically connected to the mid-plate and shielding an electromagnetic wave.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: January 2, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan Gi Park, Eun Seok Hong
  • Publication number: 20170358847
    Abstract: An electronic device including a housing; a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers; a first electrical component formed as at least a part of or in the housing; a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated; and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 14, 2017
    Inventors: Han-Min CHO, Chan-Gi Park, Yeon-Sang Yun, Tae-Wook Ham, Hei-Seong Kwak, Byoung-II Son, Sung-Chul Park
  • Publication number: 20160322759
    Abstract: A connector mounted on a printed circuit board (PCB) is provided. The connector includes a mid-plate electrically connected to a ground terminal of the PCB and including a metallic material, a plurality of upper terminals situated on the mid-plate, a plurality of lower terminals situated under the mid-plate, a first insulation member situated on the mid-plate while supporting the upper terminals, a second insulation member situated under the mid-plate while supporting the lower terminals, and a pad electrically connected to the mid-plate and shielding an electromagnetic wave.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 3, 2016
    Inventors: Chan Gi PARK, Eun Seok HONG
  • Patent number: 9337721
    Abstract: Provided is a power factor correction circuit correcting a power factor of AC voltage. The power factor correction circuit includes: a rectifying unit stopping rectifying the AC voltage in a transient state and generating an rectified voltage by rectifying the AC voltage in a steady state; a power factor correction unit generating a power-factor-corrected voltage by correcting the rectified voltage; a smoothing unit generating a smoothed voltage by smoothing the power-factor-corrected voltage; and an inrush current limiting unit providing a limited current by limiting an inrush current generated by the AC voltage in the transient state and stopping providing a current to the smoothing unit.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: May 10, 2016
    Assignee: LSIS CO., LTD.
    Inventors: Chan Gi Park, Jae Ho Lee, Ho Sang Jin
  • Patent number: 9106092
    Abstract: The present invention provides an apparatus for charging a high voltage battery of an electric vehicle by performing a control operation when the apparatus operates abnormally, the control operation discontinuing operations of a rectifier, a boost PFC (Power Factor Control) circuit and a DC-DC converter and receiving a power source from an auxiliary power supply unit, the power source charged by discharging a DC-link capacitor.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: August 11, 2015
    Assignee: LSIS Co., Ltd.
    Inventors: Chan Gi Park, Jae Ho Lee, Ho Sang Jin
  • Publication number: 20150210177
    Abstract: Disclosed is a charging control device for use in an electric vehicle to control an internal charging device of the electric vehicle. An auxiliary battery supplies DC power. A power supply device change a level of a voltage of the DC power to supply power. A power supply control device controls the supply of the DC power to the power supply device. A power supply device control signal generation unit transmits a charging start signal to the power supply control device in the case where a charging start condition is satisfied.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 30, 2015
    Applicant: LSIS CO., LTD.
    Inventors: HO SANG JIN, JAE HO LEE, CHAN GI PARK, HONG TAE PARK
  • Publication number: 20150212135
    Abstract: A connection detecting device for an electric vehicle charger, which detects whether the vehicle charger is connected to the electric vehicle, is provided. The connection detecting device includes a connection unit connecting a coupler of the vehicle charger to the electric vehicle, a power supply unit supplying a voltage to the connection unit when being turned on, a first signal generation unit generating a first signal to turn on the power supply unit when the vehicle charger is connected to the electric vehicle, and a control unit determining whether the vehicle charger is connected to the electric vehicle on the basis of the voltage applied to the connection unit. The first signal generation unit is an open circuit through which a current does not flow, when the vehicle charger is disconnected from the electric vehicle.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 30, 2015
    Applicant: LSIS CO., LTD.
    Inventors: HO SANG JIN, HONG TAE PARK, JAE HO LEE, CHAN GI PARK
  • Publication number: 20150062986
    Abstract: Provided is a power factor correction circuit correcting a power factor of AC voltage. The power factor correction circuit includes: a rectifying unit stopping rectifying the AC voltage in a transient state and generating an rectified voltage by rectifying the AC voltage in a steady state; a power factor correction unit generating a power-factor-corrected voltage by correcting the rectified voltage; a smoothing unit generating a smoothed voltage by smoothing the power-factor-corrected voltage; and an inrush current limiting unit providing a limited current by limiting an inrush current generated by the AC voltage in the transient state and stopping providing a current to the smoothing unit.
    Type: Application
    Filed: February 27, 2014
    Publication date: March 5, 2015
    Applicant: LSIS CO., LTD.
    Inventors: Chan Gi PARK, Jae Ho LEE, Ho Sang JIN
  • Publication number: 20150063421
    Abstract: A temperature measurement apparatus using a negative temperature coefficient (NTC) thermister is provided. A temperature sensor includes the NTC thermister and a variable resistor part, in which a resistance value of the variable resistor part varies between a first resistance value for a first output voltage value and a second resistance value for a second output voltage value to allow a voltage value corresponding to a present temperature to be outputted. A voltage temperature matching unit outputs the present temperature based on the first output voltage value and the second output voltage value.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 5, 2015
    Applicant: LSIS CO., LTD.
    Inventors: Ho Sang JIN, Chun Suk YANG, Jae Ho LEE, Chan Gi PARK
  • Publication number: 20150063401
    Abstract: Provided is a temperature measurement apparatus using a negative temperature coefficient (NTC) thermistor. A temperature sensor includes the NTC thermistor and a variable resistor part. A resistance value of the variable resistor part varies between a default resistance value for measuring a temperature and a temporary resistance value for determining a disconnection. An abnormal operation determination unit determines whether the NTC thermistor is disconnected, based on an output voltage of the temperature sensor when the variable resistor part has the temporary resistance value.
    Type: Application
    Filed: July 22, 2014
    Publication date: March 5, 2015
    Applicant: LSIS CO., LTD.
    Inventors: Ho Sang JIN, Chun Suk YANG, Jae Ho LEE, Chan Gi PARK