Patents by Inventor Chan-Gwi Kim

Chan-Gwi Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150183678
    Abstract: A method of cutting a non-metallic material along a curved line, is disclosed. The method includes forming an initial crack on a surface of a non-metallic material such that the initial crack is disposed on a curved line along which the non-metallic material is cut, and irradiating a laser beam along the curved line to apply thermal shock to propagate along the curved line to cut the non-metallic material along the curved line. Therefore, edge portions of the non-metallic material may not be damaged and the non-metallic material may be clearly and quickly cut.
    Type: Application
    Filed: July 18, 2013
    Publication date: July 2, 2015
    Inventors: Hyuk Park, Chan-Gwi Kim, Seong-Wook Moon