Patents by Inventor Chan-Gyun Shin

Chan-Gyun Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10703904
    Abstract: A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weight of an inorganic filler. The thermoplastic resin composition and a molded article produced therefrom are excellent in plateability, impact resistance, heat resistance and the like.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: July 7, 2020
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Ik Mo Kim, Kyung Rae Kim, Chan Gyun Shin, Sang Hyun Hong, Hyoung Taek Kang
  • Publication number: 20190352506
    Abstract: One embodiment of the present invention relates to a thermoplastic resin composition, comprising: (A) from about 30% to about 50% by weight of an aromatic polyamide resin; (B) from about 1% to about 10% by weight of an aliphatic polyamide resin; (C) from about 1% to about 15% by weight of a polyphenylene sulfide resin; (D) from about 10% to about 20% by weight of a phosphorus flame retardant; (E) from about 0.1% to about 5% by weight of a chelating agent; and (F) from about 30% to about 50% by weight of a glass fiber.
    Type: Application
    Filed: December 15, 2017
    Publication date: November 21, 2019
    Inventors: Ik Mo KIM, Kyung Rae KIM, Chan Gyun SHIN, Sang Hyun HONG
  • Patent number: 10457796
    Abstract: Provided are a polyamide resin composition and a molded article produced therefrom. The polyamide resin composition includes: a base resin including a polyamide resin having an intrinsic viscosity (IV) of about 0.9 dL/g or less and milled glass fibers; and carbon nanotube flakes having a size of about 1.0 mm to about 5.0 mm.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 29, 2019
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Kyung Rae Kim, Ik Mo Kim, Chan Gyun Shin
  • Patent number: 10450460
    Abstract: A thermoplastic resin composition of the present invention comprises: (A) an aromatic polyamide resin; (B) an aliphatic polyamide resin; (C) a first chelating agent comprising at least one of a carboxylic acid and a salt thereof, and an amino group; (D) a second chelating agent comprising an aromatic dicarboxylic acid; and (E) a filler. The thermoplastic resin composition has an excellent long-term heat stability, and thus has an advantage of maintaining mechanical properties even when exposed to high temperatures for a long period of time.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: October 22, 2019
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Kyung Rae Kim, Chan Gyun Shin, Hyoung Taek Kang, Sang Hyun Hong
  • Publication number: 20180244917
    Abstract: A thermoplastic resin composition of the present invention comprises: (A) an aromatic polyamide resin; (B) an aliphatic polyamide resin; (C) a first chelating agent comprising at least one of a carboxylic acid and a salt thereof, and an amino group; (D) a second chelating agent comprising an aromatic dicarboxylic acid; and (E) a filler. The thermoplastic resin composition has an excellent long-term heat stability, and thus has an advantage of maintaining mechanical properties even when exposed to high temperatures for a long period of time.
    Type: Application
    Filed: August 25, 2016
    Publication date: August 30, 2018
    Inventors: Kyung Rae KIM, Chan Gyun SHIN, Hyoung Taek KANG, Sang Hyun HONG
  • Publication number: 20180244919
    Abstract: A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weight of an inorganic filler. The thermoplastic resin composition and a molded article produced therefrom are excellent in plateability, impact resistance, heat resistance and the like.
    Type: Application
    Filed: August 23, 2016
    Publication date: August 30, 2018
    Inventors: Ik Mo KIM, Kyung Rae KIM, Chan Gyun SHIN, Sang Hyun HONG, Hyoung Taek KANG
  • Patent number: 9862870
    Abstract: The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: January 9, 2018
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Nam Hyun Kim, Chan Gyun Shin, Byung Kuk Jeon, Jong Cheol Lim
  • Publication number: 20170253717
    Abstract: A conductive thermoplastic resin composition, according to the present invention, comprises a polycarbonate resin and a conductive filler, wherein the conductive filler comprises carbon nanotube-modified glass fibers and/or processed carbon nanotube-modified glass fibers. A conductive thermoplastic resin composition has excellent electrical conductivity, flame retardancy, and mechanical properties.
    Type: Application
    Filed: August 28, 2015
    Publication date: September 7, 2017
    Applicant: LOTTE ADVANCED MATERIALS CO., LTD.
    Inventors: Chan Gyun SHIN, Min Soo LEE, Eun Hye JUNG, Sang Hyun HONG
  • Publication number: 20170190883
    Abstract: Provided are a polyamide resin composition and a molded article produced therefrom. The polyamide resin composition includes: a base resin including a polyamide resin having an intrinsic viscosity (IV) of about 0.9 dL/g or less and milled glass fibers; and carbon nanotube flakes having a size of about 1.0 mm to about 5.0 mm.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 6, 2017
    Inventors: Kyung Rae KIM, Ik Mo KIM, Chan Gyun SHIN
  • Patent number: 9595364
    Abstract: Provided is a conductive sheet composition including a polycarbonate resin, a rubber-modified vinyl-based graft copolymer, carbon nanotube, and a silicone particle to improve conductivity and mechanical physical properties and reduce surface gloss.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: March 14, 2017
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Eun Hye Jung, Chan Gyun Shin, Jong Cheol Lim, Nam Hyun Kim
  • Publication number: 20170029621
    Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: a base resin comprising an aliphatic polyamide resin having a terminal amine group concentration of about 0.1 ?eq/g to about 45 ?eq/g and including a repeat unit represented by the following Formula 1 wherein a is an integer from 4 to 10, and b is an integer from 6 to 12 and an aromatic polyamide resin including a repeat unit represented by the following Formula 2 wherein c is an integer from 6 to 12; and inorganic fillers. The polyamide resin composition can exhibit excellent properties in terms of impact resistance, stiffness, processability, appearance, and balance therebetween.
    Type: Application
    Filed: July 28, 2016
    Publication date: February 2, 2017
    Inventors: Nam Hyun KIM, Chan Gyun SHIN, Sang Hyun HONG, Jee Kwon PARK
  • Patent number: 9481786
    Abstract: Disclosed is a thermoplastic rubber composition comprising, based on 100 parts by weight of a block terpolymer (A) of an aromatic vinyl compound and an alkene compound, 50 to 100 parts by weight of a paraffin oil (B), 30 to 70 parts by weight of an inorganic additive (C), 5 to 30 parts by weight of a polyolefin-based resin (D), and 30 to 70 parts by weight of an acryl-based resin (E). The hardness of the thermoplastic rubber composition may be freely adjusted and the thermoplastic rubber composition has a bonding strength of 2 to 4 N/mm as measured using a UTM according to a KS M 6518 peeling test method. Accordingly, bonding strength thereof to a thermoplastic resin is increased even without addition of an adhesive.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: November 1, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jung Wook Kim, Chan Gyun Shin, Jong Cheol Lim
  • Publication number: 20160200957
    Abstract: The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.
    Type: Application
    Filed: December 2, 2013
    Publication date: July 14, 2016
    Inventors: Nam Hyun KIM, Chan Gyun SHIN, Byung Kuk JEON, Jong Cheol LIM
  • Patent number: 9283703
    Abstract: An integrated LED lamp housing can include a heat radiation section and a light transmission section. The integrated LED lamp housing can be prepared by co-extruding different polycarbonate resin compositions.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: March 15, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Chan Gyun Shin, Hoo Seok Lee, Nam Hyun Kim, Jeong Won Lee, Jong Cheol Lim
  • Publication number: 20160046802
    Abstract: Disclosed is a thermoplastic rubber composition comprising, based on 100 parts by weight of a block terpolymer (A) of an aromatic vinyl compound and an alkene compound, 50 to 100 parts by weight of a paraffin oil (B), 30 to 70 parts by weight of an inorganic additive (C), 5 to 30 parts by weight of a polyolefin-based resin (D), and 30 to 70 parts by weight of an acryl-based resin (E). The hardness of the thermoplastic rubber composition may be freely adjusted and the thermoplastic rubber composition has a bonding strength of 2 to 4 N/mm as measured using a UTM according to a KS M 6518 peeling test method. Accordingly, bonding strength thereof to a thermoplastic resin is increased even without addition of an adhesive.
    Type: Application
    Filed: June 26, 2013
    Publication date: February 18, 2016
    Inventors: Jung Wook Kim, Chan Gyun Shin, Jong Cheol Lim
  • Patent number: 9080039
    Abstract: A thermoplastic resin composition comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the thermal diffusivity of the thermoplastic resin composition in the horizontal or vertical direction is about 0.065 to about 0.20 cm2/sec and the ratio of thermal diffusivity of the horizontal direction:vertical direction is about 1:0.5 to about 1:1. A thermoplastic resin composition according to a second embodiment comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the spherical magnesium oxide is treated on its surface with a silane compound.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: July 14, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Chan Gyun Shin, Jeong Won Lee, Jong Cheol Lim, Nam Hyun Kim
  • Publication number: 20150093562
    Abstract: A conductive thermoplastic resin composition includes polyethersulfone resin and a carbon nanotube (CNT)-oriented glass fiber. The conductive thermoplastic resin composition can have high electrical conductivity and remarkably improved mechanical physical properties with a small amount of CNTs.
    Type: Application
    Filed: October 1, 2014
    Publication date: April 2, 2015
    Inventors: Kyung Rae KIM, Chan Gyun SHIN, Jung Wook KIM, Jong Cheol LIM
  • Publication number: 20150028266
    Abstract: Provided is a conductive sheet composition including a polycarbonate resin, a rubber-modified vinyl-based graft copolymer, carbon nanotube, and a silicone particle to improve conductivity and mechanical physical properties and reduce surface gloss.
    Type: Application
    Filed: July 25, 2014
    Publication date: January 29, 2015
    Inventors: Eun Hye JUNG, Chan Gyun SHIN, Jong Cheol LIM, Nam Hyun KIM
  • Publication number: 20140356579
    Abstract: An electric conductive resin composition comprises about 0.5 to about 5 parts by weight of (C) carbon nanotubes, based on about 100 parts by weight of a base resin comprising about 50 to about 97% by weight of (A) a polycarbonate resin and about 3 to about 50% by weight of (B) a rubber-modified aromatic vinyl resin (B1), a semi-crystalline polymer resin (B2), or a mixture thereof. The electric conductive resin composition has a surface resistance of about 105?/? or less and can have excellent conductivity. Further, the composition can have excellent productivity, tensile strength and/or tensile elongation, and/or generates little dust.
    Type: Application
    Filed: February 11, 2014
    Publication date: December 4, 2014
    Applicant: Cheil Industries Inc.
    Inventors: Chan Gyun Shin, Jong Cheol Lim, Eun Hye Jung
  • Publication number: 20140264181
    Abstract: A thermoplastic resin composition includes (A) about 50 to about 90% by weight of a crystalline thermoplastic resin having a melting point of about 200 to about 380° C.; and (B) about 10 to about 50% by weight of a filler in which a carbon nanostructure having an average length of about 1 to about 1000 ?m and an average diameter of about 1 to about 100 nm is grown on a glass fiber surface. The thermoplastic resin composition can have excellent EMI shielding property and/or fluidity.
    Type: Application
    Filed: February 19, 2014
    Publication date: September 18, 2014
    Applicant: Cheil Industries Inc.
    Inventors: Chan Gyun Shin, Kyung Rae Kim, Jung Wook Kim, Jong Cheol Lim, Byung Kuk Jeon