Patents by Inventor Chanho SHIN

Chanho SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DUAL-CURABLE ADHESIVE COMPOSITION
    Publication number: 20230015729
    Abstract: The present invention provides a dual-curable hybrid adhesive composition including a photo-initiator, a thermal initiator, and a thiol group-containing compound, and more particularly, to an adhesive composition which may be cured through a single curing by ultraviolet (UV) light or heat, and where thermal curing proceeds concurrently with UV curing by a heat generated during the UV curing such that even a light shield portion which may not transmit UV light therethrough may be sufficiently cured.
    Type: Application
    Filed: December 5, 2019
    Publication date: January 19, 2023
    Applicant: HANSOL CHEMICAL CO.,LTD.
    Inventors: Chanho SHIN, Joohan WOO, Cheolwoo LEE, Sungmin HA, Chunrae NAM
  • Methods of stacking semiconductor dies
    Patent number: 10497691
    Abstract: A method of stacking semiconductor dies includes attaching a lower semiconductor die to a base substrate with an adhesive layer and attaching an upper semiconductor die to the lower semiconductor die with another adhesive layer. A thermo-compression bonding technique is applied to the upper semiconductor die to cure the adhesive layers and to bond the upper semiconductor die to the lower semiconductor die.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: December 3, 2019
    Assignee: SK hynix Inc.
    Inventors: Chanho Shin, Seunghwan Kim, Pil Soon Bae, Hwijo Jeong
  • METHODS OF STACKING SEMICONDUCTOR DIES
    Publication number: 20190333910
    Abstract: A method of stacking semiconductor dies includes attaching a lower semiconductor die to a base substrate with an adhesive layer and attaching an upper semiconductor die to the lower semiconductor die with another adhesive layer. A thermo-compression bonding technique is applied to the upper semiconductor die to cure the adhesive layers and to bond the upper semiconductor die to the lower semiconductor die.
    Type: Application
    Filed: November 9, 2018
    Publication date: October 31, 2019
    Applicant: SK hynix Inc.
    Inventors: Chanho SHIN, Seunghwan KIM, Pil Soon BAE, Hwijo JEONG