Patents by Inventor Chan Jin
Chan Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240369190Abstract: An embodiment pressure vessel includes a nozzle part, a liner part, and a composite material part. The nozzle part extends upward and includes a first nozzle portion and a second nozzle portion connected to a lower side of the first nozzle portion and having a greater diameter than a diameter of the first nozzle portion, and an area of the second nozzle portion adjacent to the first nozzle portion in a top-down view defines a first boundary area. The liner part defines an inner space and surrounds a lower side of the nozzle part, and an upper end of the liner part covers the first boundary area, and the composite material part is coupled to an outer side of the liner part and is configured to surround the liner part.Type: ApplicationFiled: October 17, 2023Publication date: November 7, 2024Inventor: Chan Jin Kim
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Publication number: 20240298411Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.Type: ApplicationFiled: May 13, 2024Publication date: September 5, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Jong Eun Park, Hyun Seok Yang, Sangik Cho, Hiroki Okada, Young Ook Cho, Mi Jeong Jeon, In Jae Chung
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Publication number: 20240227509Abstract: One exemplary embodiment of the present invention relates to a thermal management fluid module for a vehicle using a circulating fluid such as a refrigerant or a coolant, the thermal management fluid module including a manifold plate in which a plurality of fluid flow channels are formed, and a thermal interference avoidance unit which is coupled to the manifold plate and in which fluid flow channels having a relatively high temperature or low temperature are formed to be separated and spaced apart from other fluid flow channels among the fluid flow channels.Type: ApplicationFiled: October 18, 2023Publication date: July 11, 2024Inventors: In Keun KANG, Young Man KIM, Kyeong Cheol LEE, Jae Min LEE, Chan Jin LEE
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Patent number: 12028973Abstract: A printed circuit board includes a first insulating layer, a metal layer disposed on one surface of the first insulating layer, a first circuit layer disposed inside the first insulating layer and having one surface exposed to the one surface of the first insulating layer so as to be in contact with one surface of the metal layer, a second circuit layer in contact with the other surface of the metal layer, and a second insulating layer disposed on the one surface of the first insulating layer to cover the metal layer and the second circuit layer. The first and second circuit layers respectively include a metal different from the metal layer.Type: GrantFiled: October 14, 2021Date of Patent: July 2, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Young Ook Cho, Hyun Seok Yang, Ki Joo Sim, Won Seok Lee, Mi Jeong Jeon
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Publication number: 20240215158Abstract: A printed circuit board includes a first insulating layer, a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof, and a second metal layer disposed on the first metal layer. A method of manufacturing a printed circuit board includes forming a first metal layer on a first insulating layer, forming a second metal layer on a portion of the first metal layer, oxidizing another portion of the first metal layer to form a first oxidation region, and removing at least a portion of the first oxidation region.Type: ApplicationFiled: June 14, 2023Publication date: June 27, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Jeong JEON, Hyun Seok YANG, Tae Hee YOO, Chan Jin PARK
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Patent number: 12016130Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.Type: GrantFiled: March 1, 2022Date of Patent: June 18, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Jong Eun Park, Hyun Seok Yang, Sangik Cho, Hiroki Okada, Young Ook Cho, Mi Jeong Jeon, In Jae Chung
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Publication number: 20240190203Abstract: A thermal management fluid module for a vehicle according to one embodiment of the present invention includes a manifold plate, in which a fluid passage is formed in one surface of the manifold plate and the fluid passage is formed along one passage layer, and a valve which is coupled to another surface of the manifold plate and expands a fluid or controls a flow direction of the fluid, wherein the valve is disposed on a layer different from the passage layer of the fluid passage and can communicate with the fluid passage.Type: ApplicationFiled: December 8, 2023Publication date: June 13, 2024Inventors: In Keun KANG, Young Man KIM, Kyeong Cheol LEE, Jae Min LEE, Chan Jin LEE
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Publication number: 20240164013Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.Type: ApplicationFiled: July 12, 2023Publication date: May 16, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Heun LEE, Jong Eun PARK, Chan Jin PARK, Hyun Seok YANG, Tae Hee YOO
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Publication number: 20240152796Abstract: An N-value prediction apparatus according to an embodiment of the present invention includes a hypothetical learning data augmentation unit, based on an actual N-value measured at an actual location according to the Standard Penetration Test through drilling investigation, generating at least one of hypothetical N-values corresponding to a preset hypothetical point based on the actual location, an N-value prediction model learning unit learning ground characteristic data corresponding to each of the actual location and the hypothetical point by artificial intelligence, the ground characteristic data including the actual N-value and the hypothetical N-values, and an N-value prediction result calculation unit predicting an N-value at an arbitrary prediction target point by using an N-value prediction model generated by artificial intelligence learning executed in the N-value prediction model learning unit.Type: ApplicationFiled: November 26, 2021Publication date: May 9, 2024Inventors: Kwang Myung KIM, Hyuong June PARK, Jae Beom LEE, Chan Jin PARK
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Publication number: 20240131903Abstract: One exemplary embodiment of the present invention relates to a thermal management fluid module for a vehicle using a circulating fluid such as a refrigerant or a coolant, the thermal management fluid module including a manifold plate in which a plurality of fluid flow channels are formed, and a thermal interference avoidance unit which is coupled to the manifold plate and in which fluid flow channels having a relatively high temperature or low temperature are formed to be separated and spaced apart from other fluid flow channels among the fluid flow channels.Type: ApplicationFiled: October 17, 2023Publication date: April 25, 2024Inventors: In Keun KANG, Young Man KIM, Kyeong Cheol LEE, Jae Min LEE, Chan Jin LEE
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Patent number: 11937378Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.Type: GrantFiled: March 10, 2022Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Hyun Seok Yang
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Publication number: 20230342905Abstract: An apparatus and method for inspecting a vehicle include photographing a lower side of a vehicle to obtain a lower side image, transmitting the lower image to a server, receiving inspection result data of the lower side of the vehicle from the server, and displaying the inspection result data on a display, wherein the received inspection result data includes a result obtained by generating a defect image of the lower side of the vehicle from a virtual image, in which a defect is indicated, of a reference lower image of the vehicle, and determine whether the lower side of the vehicle is defective using the generated defect image.Type: ApplicationFiled: April 20, 2023Publication date: October 26, 2023Applicants: Hyundai Motor Company, KIA CORPORATIONInventors: Chan Jin KANG, Minhoe HUR, Jaesik MIN
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Publication number: 20230092667Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.Type: ApplicationFiled: November 21, 2022Publication date: March 23, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Hyun Seok Yang
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Publication number: 20230086970Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.Type: ApplicationFiled: March 10, 2022Publication date: March 23, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Hyun Seok Yang
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Patent number: 11600913Abstract: An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.Type: GrantFiled: February 23, 2021Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Ho Kim, Chan Jin Park
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Publication number: 20220386473Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.Type: ApplicationFiled: March 1, 2022Publication date: December 1, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Jong Eun Park, Hyun Seok Yang, Sangik Cho, Hiroki Okada, Young Ook Cho, Mi Jeong Jeon, In Jae Chung
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Patent number: 11436499Abstract: System and method for detecting domain names that exhibit Domain Generation Algorithm (DGA) like behaviours from a stream of Domain Name System (DNS) records. In particular, this document describes a system comprising a deep learning classifier (DL-C) module for receiving and filtering the stream of DNS records before the filtered DNS records, which have been determined to possess domain names that exhibit DGA behaviour are provided to a series filter-classifier (SFC) module. The SFC module then groups the records into various series based on source IP, destination IP and time. For each series, it then filters away records that do not exhibit the dominant DGA characteristics of the series. Finally, for each series, it makes use of the remaining DNS records' timestamps to generate a time series of DGA occurrences and then, using this time series of occurrences, determine the number of DGA bursts throughout the time period of analysis.Type: GrantFiled: December 16, 2021Date of Patent: September 6, 2022Assignee: Ensign InfoSecurity Pte. Ltd.Inventors: Lee Joon Sern, Gui Peng David Yam, Quek Han Yang, Chan Jin Hao
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Patent number: 11438356Abstract: This document discloses a system and method for detecting and classifying potential malicious network behaviours or characteristics contained within data traffic. In particular, this document discloses a system comprising a data pre-processing module for processing the received data traffic before the processed data traffic is provided to an alert module communicatively connected to the data pre-processing module. The alert module, which comprises a trained autoencoder and a classifier neural network trained via self-taught learning, then determines, based on a set of partially labelled training data, whether potential malicious network behaviours that typically present themselves as network traffic anomalies are contained within the processed data traffic.Type: GrantFiled: September 1, 2021Date of Patent: September 6, 2022Assignee: Ensign InfoSecurity Ptd. Ltd.Inventors: Lee Joon Sern, Quek Hanyang, Chan Jin Hao
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Patent number: 11408481Abstract: A shock absorber includes: a cylinder which is filled with a fluid; a piston valve which includes a valve seat dividing an inner space of the cylinder, a passage which is formed in the valve seat and through which the fluid passes, and a valve disposed to cover the passage and interfering with a flow of the fluid; a performance controller which is disposed in the cylinder to control at least one of a spring constant, a damping force, or a combination thereof; and a piston support which is connected to the piston valve and exposed to an outside.Type: GrantFiled: June 28, 2018Date of Patent: August 9, 2022Assignee: GARISANI., INCInventor: Il Chan Jin
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Publication number: 20220245461Abstract: This document describes a system and method for detecting domain names that exhibit Domain Generation Algorithm (DGA) like behaviours from a stream of Domain Name System (DNS) records. In particular, this document describes a system comprising a deep learning classifier (DL-C) module for receiving and filtering the stream of DNS records before the filtered DNS records, which have been determined to possess domain names that exhibit DGA behaviour are provided to a series filter-classifier (SFC) module. The SFC module then groups the records into various series based on source IP, destination IP and time. For each series, it then filters away records that do not exhibit the dominant DGA characteristics of the series. Finally, for each series, it makes use of the remaining DNS records' timestamps to generate a time series of DGA occurrences and then, using this time series of occurrences, determine the number of DGA bursts throughout the time period of analysis.Type: ApplicationFiled: December 16, 2021Publication date: August 4, 2022Inventors: Lee Joon Sern, Gui Peng David Yam, Quek Han Yang, Chan Jin Hao