Patents by Inventor Chan-Jiun Ed Jih

Chan-Jiun Ed Jih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Meniscus-shape terminations for leadless electronic components
    Patent number: 5813884
    Abstract: There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: September 29, 1998
    Assignee: Ford Global Technologies, Inc.
    Inventors: Yi-Hsin Pao, Dangrong Ronald Liu, Chan-Jiun Ed Jih, Xu Song