Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.

Abstract: A prelithiated negative electrode, and a secondary battery including a prelithiated electrode, including a negative electrode current collector; and a negative electrode active material layer present on at least one surface of the negative electrode current collector. The negative electrode active material layer includes high-capacity artificial graphite having no carbon coating. The negative electrode active material layer is prelithiated, and the content of lithium intercalated to the prelithiated negative electrode active material layer is 3% to 5% based on the lithium content intercalated when the negative electrode is charged to 100%.

Abstract: An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.

Abstract: An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.

Abstract: A chip stack package has semiconductor chips connected to the substrate by the same signal pathway lengths to prevent malfunction of the semiconductor chips. In the chip stack package, first and second semiconductor chips disposed opposite to each other. The first and second semiconductor chips having bonding bumps are bonded to upper and bottom surfaces of the pattern tape. The bonded chips are then bonded to an upper surface of a substrate. The bond fingers of the substrate are in electrical contact with the bond leads of the pattern tape. Ball lands are formed on the bottom surface of the substrate to which solder balls are attached.